CAJ | 학술논문

核/壳结构有机/无机复合微球作为一种新型抛光介质,在实现高效无损伤抛光方面具有重要的应用价值.以无皂乳液聚合法制备的聚苯乙烯(PS)为内核,通过溶胶-凝胶法合成了一系列具有不同内核尺寸的 PS/SiO 2复合微球.利用 FT-IR、FESEM 和TEM 等手段对样品进行表征,并借助 AFM 考察了复合磨料内核尺寸对 SiO 2介质层抛光质量的影响规律.结果表明,所制备单分散 PS 微球尺寸在200~600 nm,复合微球的壳层由 SiO 2纳米颗粒(5~10 nm)所组成,壳厚在10~15 nm.材料去除率(MRR)随复合磨料内核尺寸的减小而降低,而抛光后晶片表面粗糙度(RMS)的变化则不明显.当复合磨料内核尺寸为210 nm 时,抛光后 RMS 和 MRR 分别为0．217 nm 和126．2 nm/min.提出将核壳结构有机/无机复合磨料理解成一种表面布满无机纳米颗粒的微型“抛光垫”,尝试用有效磨料数量以及壳层中单个 SiO 2颗粒的压入深度对 CMP 实验结果进行解释,并进一步讨论了有机内核在抛光过程中的作用.
핵/각결구유궤/무궤복합미구작위일충신형포광개질,재실현고효무손상포광방면구유중요적응용개치.이무조유액취합법제비적취분을희(PS)위내핵,통과용효-응효법합성료일계렬구유불동내핵척촌적 PS/SiO 2복합미구.이용 FT-IR、FESEM 화TEM 등수단대양품진행표정,병차조 AFM 고찰료복합마료내핵척촌대 SiO 2개질층포광질량적영향규률.결과표명,소제비단분산 PS 미구척촌재200~600 nm,복합미구적각층유 SiO 2납미과립(5~10 nm)소조성,각후재10~15 nm.재료거제솔(MRR)수복합마료내핵척촌적감소이강저,이포광후정편표면조조도(RMS)적변화칙불명현.당복합마료내핵척촌위210 nm 시,포광후 RMS 화 MRR 분별위0．217 nm 화126．2 nm/min.제출장핵각결구유궤/무궤복합마료리해성일충표면포만무궤납미과립적미형“포광점”,상시용유효마료수량이급각층중단개 SiO 2과립적압입심도대 CMP 실험결과진행해석,병진일보토론료유궤내핵재포광과정중적작용.
Core/shell organic/inorganic composite microspheres as novel abrasives have an important application in efficient and damage-free polishing due to their uniform non-rigid mechanical properties.A series of polysty-rene (PS)microspheres with various sizes were synthesized by surfactant-free emulsion polymerization method and then coated with silica nanoparticles by sol-gel process to obtain the core/shell structured PS/SiO 2 compos-ites.The as-synthesized samples were characterized by FT-IR,FESEM and TEM technique.The effect of the core size of the PS/SiO 2 composite abrasives on oxide-CMP behavior were investigated by AFM.The results in-dicated that the size of the obtained PS microspheres ranged from 200 to 600 nm.The shells of the composites were composed of SiO 2 nanoparticles (5-10 nm),and the shell thickness was 10-15 nm.After CMP,with the decrease of the core size,the material removal rate (MRR)was decreasing,while the root mean square (RMS) of the wafer surface almost retain constant.For the composite of the core size of 210 nm,the RMS and MRR values were 0.217 nm and 126.2 nm/min,respectively.We proposed that the core/shell organic/inorganic com-posites could be considered as micro-polishing pads,which were covered with inorganic nanoparticles.The mod-el used to explain the results take into account both the total number of active abrasives and the indentation depth of single SiO 2 particle onto the wafer surface,and the effect of the PS cores on the behavior of composite abrasives was also discussed.