佳木斯大学学报(自然科学版)
佳木斯大學學報(自然科學版)
가목사대학학보(자연과학판)
JOURNAL OF JIAMUSI UNIVERSITY (NATURAL SCIENCE EDITION)
2014年
5期
723-725
,共3页
刘冬梅%王晶彦%张德秋%李晓林
劉鼕梅%王晶彥%張德鞦%李曉林
류동매%왕정언%장덕추%리효림
无机胶粘剂%调胶比%剪切强度%固化
無機膠粘劑%調膠比%剪切彊度%固化
무궤효점제%조효비%전절강도%고화
inorganic adhesive%glue ratio%shear strength%curing
采用H3 PO4,Al( OH)3为主要原料合成金属基陶瓷涂层用无机胶粘剂,以磷酸盐胶粘剂为基料,添加氧化铜为固化剂,通过设计氧化铜和磷酸盐的配比即调胶比配制而成;并将其刷涂在金属基体表面。研究氧化铜粒度、调胶比、固化温度和时间对胶黏剂粘结强度的影响;利用电子万能试验机测试其拉伸、剪切强度。采用扫描电镜分析粘结机理。结果表明:随着磷酸盐密度增大,调胶比由小到大时,胶粘剂的粘接强度由大变小。随着固化时间的增加,胶粘剂的粘接强度增大;随着固化温度的升高,胶粘剂的粘接强度先增大后减小。胶粘剂Al/P=1:3、氧化铜粉粒径为200~400目、调胶比为4g/ml、固化温度为160℃、固化时间不少于3h时,能达到理想的粘接强度。基体与胶粘剂的界面结合强度源于机械互锁与互扩散。
採用H3 PO4,Al( OH)3為主要原料閤成金屬基陶瓷塗層用無機膠粘劑,以燐痠鹽膠粘劑為基料,添加氧化銅為固化劑,通過設計氧化銅和燐痠鹽的配比即調膠比配製而成;併將其刷塗在金屬基體錶麵。研究氧化銅粒度、調膠比、固化溫度和時間對膠黏劑粘結彊度的影響;利用電子萬能試驗機測試其拉伸、剪切彊度。採用掃描電鏡分析粘結機理。結果錶明:隨著燐痠鹽密度增大,調膠比由小到大時,膠粘劑的粘接彊度由大變小。隨著固化時間的增加,膠粘劑的粘接彊度增大;隨著固化溫度的升高,膠粘劑的粘接彊度先增大後減小。膠粘劑Al/P=1:3、氧化銅粉粒徑為200~400目、調膠比為4g/ml、固化溫度為160℃、固化時間不少于3h時,能達到理想的粘接彊度。基體與膠粘劑的界麵結閤彊度源于機械互鎖與互擴散。
채용H3 PO4,Al( OH)3위주요원료합성금속기도자도층용무궤효점제,이린산염효점제위기료,첨가양화동위고화제,통과설계양화동화린산염적배비즉조효비배제이성;병장기쇄도재금속기체표면。연구양화동립도、조효비、고화온도화시간대효점제점결강도적영향;이용전자만능시험궤측시기랍신、전절강도。채용소묘전경분석점결궤리。결과표명:수착린산염밀도증대,조효비유소도대시,효점제적점접강도유대변소。수착고화시간적증가,효점제적점접강도증대;수착고화온도적승고,효점제적점접강도선증대후감소。효점제Al/P=1:3、양화동분립경위200~400목、조효비위4g/ml、고화온도위160℃、고화시간불소우3h시,능체도이상적점접강도。기체여효점제적계면결합강도원우궤계호쇄여호확산。
The metal matrix ceramic inorganic adhesive was prepared by the reaction of Al ( OH ) 3 and H3 PO4 .The based material phosphate adhesive and curing agent copper oxide were coated on the surface of met -al substrate with different tune -cement ratio .The effect of copper oxide particle size , tune-cement ratio , cu-ring temperature and time was studied .The tensile shear strength was tested by electronic universal testing ma-chine .The bond mechanism was analyzed by scanning electron microscopy .The results showed that with the in-crease of density of phosphate and glue ratio , the bonding strength of adhesive decreased , with the increase of curing time, the bonding strength of adhesive increased , and with the increase of curing temperature , the bond-ing strength of adhesive increased firstly and then decreased .The desired bond strength was achieved in condi-tion of adhesive Al/P=1:3, copper oxide particle size of 200~400 meshes, glue ratio of 4g/ml, curing temper-ature of 160℃, and the curing time of not less than 3h.The substrate and adhesive was combined due to me-chanical interlocking and mutual diffusion .