电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2014年
10期
43-48
,共6页
半导体%封测%产业特点%全球顶尖公司%现状分析
半導體%封測%產業特點%全毬頂尖公司%現狀分析
반도체%봉측%산업특점%전구정첨공사%현상분석
semiconductor%packaging (assembly and test)%industry characteristics%global top company%analysis in current status
半导体是一种重要的电子元器件,半导体产业是衡量一个国家或地区技术水平的重要标识之一。基于此,首先阐述并理清了半导体、半导体产业和半导体封测相关的基本概念(定义、功用、制作流程)。之后,详细分析了半导体、封测产业的特点(商业模式、进入壁垒),全球半导体、封测产业的整体状况以及半导体前20强公司、封测前10强公司的运营现状。最后,从半导体产业特点、分工及转移角度给出了分析结论:半导体、封测代工产业不易进入;封测代工业能长期保持小幅增长;发展中国家、地区应该优先发展封测业。
半導體是一種重要的電子元器件,半導體產業是衡量一箇國傢或地區技術水平的重要標識之一。基于此,首先闡述併理清瞭半導體、半導體產業和半導體封測相關的基本概唸(定義、功用、製作流程)。之後,詳細分析瞭半導體、封測產業的特點(商業模式、進入壁壘),全毬半導體、封測產業的整體狀況以及半導體前20彊公司、封測前10彊公司的運營現狀。最後,從半導體產業特點、分工及轉移角度給齣瞭分析結論:半導體、封測代工產業不易進入;封測代工業能長期保持小幅增長;髮展中國傢、地區應該優先髮展封測業。
반도체시일충중요적전자원기건,반도체산업시형량일개국가혹지구기술수평적중요표식지일。기우차,수선천술병리청료반도체、반도체산업화반도체봉측상관적기본개념(정의、공용、제작류정)。지후,상세분석료반도체、봉측산업적특점(상업모식、진입벽루),전구반도체、봉측산업적정체상황이급반도체전20강공사、봉측전10강공사적운영현상。최후,종반도체산업특점、분공급전이각도급출료분석결론:반도체、봉측대공산업불역진입;봉측대공업능장기보지소폭증장;발전중국가、지구응해우선발전봉측업。
Semiconductor is a kind of important electronic components and the semiconductor industry is one of the important symbols to measure the technology level of a country or region. Based on it, the paper explains and clarifies the basic concept including definition, function and manufacturing process of semiconductor, semiconductor industry, packaging (assembly and test) and packaging industry firstly. Then, it analyzes the industry characteristics including the business model and barrier to entry of semiconductor and packaging, the whole status of global semiconductor and packaging industry, and the current status of global top 20 companies in the field of semiconductor and packaging in details. Finally, it comes to a conclusion based on the analysis in the industry characteristics, industrial division and transfer of industry in the semiconductor industry, which is that it is not easy to enter the semiconductor and packaging industry, packaging industry can increase by a small margin in the long terms, and developing country or region should give priority to the development of packaging industry.