印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2014年
10期
49-51
,共3页
退洗药水%超声波%基材白纹%油墨塞孔
退洗藥水%超聲波%基材白紋%油墨塞孔
퇴세약수%초성파%기재백문%유묵새공
Back Wash Syrup%Ultrasound%Base Material of White Streaks%Ink Plugging HSole
针对PCB制程中防焊退洗出现的品质问题，从退洗原因、退洗设备构成、退洗物料配制、工艺参数选取等方面，结合实际工作中的生产跟进分析，制定完善的控制方法，预防及保证返工产品性能满足客户需求，减少PCB的报废。
針對PCB製程中防銲退洗齣現的品質問題，從退洗原因、退洗設備構成、退洗物料配製、工藝參數選取等方麵，結閤實際工作中的生產跟進分析，製定完善的控製方法，預防及保證返工產品性能滿足客戶需求，減少PCB的報廢。
침대PCB제정중방한퇴세출현적품질문제，종퇴세원인、퇴세설비구성、퇴세물료배제、공예삼수선취등방면，결합실제공작중적생산근진분석，제정완선적공제방법，예방급보증반공산품성능만족객호수구，감소PCB적보폐。
Back wash quality problems of solder resist for PCB manufacturing process arise from in back wash. This paper introduces the back wash equipment constitute, back wash material in manufacturing, process parameter selection and other aspects. It is also combined with the practical work of the production follow-up analysis, the development of improved control methods, prevention and ensuring of heavy product performance to meet customer demand, while reducing scrap.
