CAJ | 학술논문

随着电路设计高频化，对挠性印制电路板的可靠性提出了更加严格的要求。高频信号快速有效地传递，需要优化使用基板材料，粘合剂，铜箔等材料的选择。本文对在高频条件下挠性印制电路板材料的性质进行了分析介绍，并提出了几点建议。
수착전로설계고빈화，대뇨성인제전로판적가고성제출료경가엄격적요구。고빈신호쾌속유효지전체，수요우화사용기판재료，점합제，동박등재료적선택。본문대재고빈조건하뇨성인제전로판재료적성질진행료분석개소，병제출료궤점건의。
As circuit design tends to using high frequency, it takes more strict requirements for the reliability of flexible printed circuit board (FPC). Quickly and efficiently spreading of high-frequency needs to optimize the selection of materials such as substrate, adhesives, and copper foil. In this paper we discuss the material properties of FPC for high-frequency applications and present several suggestions.