CAJ | 학술논문

针对埋容板板边分层问题，通过分析并跟进埋容板生产各关键制程，确认了埋容板板边分层的原因。受机械应力作用时铜层与埋容材料层之间出现微小裂纹，随着机械应力作用次数的增加，裂纹扩展导致分层。通过试验验证，更改了埋容层芯板的制作照相底片，彻底解决了埋容板板边分层的问题。
침대매용판판변분층문제，통과분석병근진매용판생산각관건제정，학인료매용판판변분층적원인。수궤계응력작용시동층여매용재료층지간출현미소렬문，수착궤계응력작용차수적증가，렬문확전도치분층。통과시험험증，경개료매용층심판적제작조상저편，철저해결료매용판판변분층적문제。
The reasons of the delamination of capacitors embedded in the PCB had been confirmed by following up the production process, making slices of metallic phase and analyzing the elements of metallic phase. The mechanical properties differed in dielectric layer and copper layer. Crack occurred in capacitors embedded PCB when the PCB were subjected to mechanical stresses. The size of the crack increased with the increase of the action numbers of mechanical stress, which led to the delamination of capacitors embedded in the printed circuit board. The film used for making capacitors embedded in the PCB had been changed and the problem of the delamination had been completely solved.