CAJ | 학술논문

铝基板是一种最常见的金属基覆铜板，因其具有良好的导热性、电气绝缘性和尺寸稳定性，目前已被广泛应用。文章通过对铝基印制后续装配机理及过程的分析，从提高散热性能及减少装配空间的角度出发，进行了大胆的尝试，将承载印制板的机箱与印制板合二为一，产品实现了线路板与机箱的高度集成，取得了散热效果良好，缩小产品体积的目的。
려기판시일충최상견적금속기복동판，인기구유량호적도열성、전기절연성화척촌은정성，목전이피엄범응용。문장통과대려기인제후속장배궤리급과정적분석，종제고산열성능급감소장배공간적각도출발，진행료대담적상시，장승재인제판적궤상여인제판합이위일，산품실현료선로판여궤상적고도집성，취득료산열효과량호，축소산품체적적목적。
The aluminum substrate is one of the most common metal base copper clad. Because of its good thermal conductivity, electrical insulation and dimensional stability, it has been widely used. Based on aluminum printed subsequent assembly mechanism and analysis of the process, this article intended to improve the heat dissipation performance and reduce the assembly space angle. It carried on the bold attempt, combined bearing chassis of PCB and PCB, the circuit board and the case of a highly integrated product realization, and obtained the good heat dissipation effect, and reduced the size of our products.