CAJ | 학술논문

电子产业高速发展，越来越多的领域应用铝基印制板，使得铝基板的发展突飞猛进，传统FR-4线路板制造商纷纷开发铝基板技术。因此推动了铝基板的制作技术从单面向双面甚至是多层方向发展。这里对双面铝基板制作进行简单汇总与描述。
전자산업고속발전，월래월다적영역응용려기인제판，사득려기판적발전돌비맹진，전통FR-4선로판제조상분분개발려기판기술。인차추동료려기판적제작기술종단면향쌍면심지시다층방향발전。저리대쌍면려기판제작진행간단회총여묘술。
The fast development of electronic industry, aluminum based PCB in the application fields are getting more and more development. The traditional FR4 circuit board manufacturers have developed the aluminum substrate technology. Therefore, this article promoted the production technology of aluminum substrate from single to double or multi direction, and made simple summary and description.