CAJ | 학술논문

为了快速有效地测试和分析集成电路封装的热特性，本文以激光电子散斑干涉术（ESPI）为测量手段，在分析了集成电路热学结构模型的基础上，建立了离面位移的响应方程。选用大规模的集成电路CPU486为实验对象，并以动态老化的方式实现了实验样品的功率加载，通过电子散斑干涉方法得到了离面位移的响应曲线，并对其处理得到了热阻-热容关系曲线。实验结果与相关文献数据吻合，表明利用电子散斑测量集成电路封装的热特性是可行性的。
위료쾌속유효지측시화분석집성전로봉장적열특성，본문이격광전자산반간섭술（ESPI）위측량수단，재분석료집성전로열학결구모형적기출상，건립료리면위이적향응방정。선용대규모적집성전로CPU486위실험대상，병이동태노화적방식실현료실험양품적공솔가재，통과전자산반간섭방법득도료리면위이적향응곡선，병대기처리득도료열조-열용관계곡선。실험결과여상관문헌수거문합，표명이용전자산반측량집성전로봉장적열특성시가행성적。
To quickly and effectively measure and analysis thermal characteristics of IC, Measurement method based on ESPI(electronic speckle pattern interferometer) is proposed in this paper, off-surface response function is es-tablished by analysis thermal structure model of IC Package. Taking VLSI CPU486 for experimental, power loading is implemented by dynamic burn-in mode, Off-surface response curve is obtained by the electronic speckle pattern in-terferometry (ESPI) , curve of thermal resistance-thermal capacity is extracted by further processing of Off-surface response curve. Experimental results are agreement with the data of reference document closely, which demonstrates feasibility of proposed method.