北京工业大学学报
北京工業大學學報
북경공업대학학보
JOURNAL OF BEIJING POLYTECHNIC UNIVERSITY
2014年
11期
1759-1762
,共4页
微机电系统%聚合物固体电解质%阳极键合%离子导电
微機電繫統%聚閤物固體電解質%暘極鍵閤%離子導電
미궤전계통%취합물고체전해질%양겁건합%리자도전
micro-electro-mechanical system%solid polymer electrolytes%anodic bonding%ionic conductivity
为了促进微机电系统封装技术的发展,设计了应用聚氧化乙烯(polyethylene oxide,PEO)作为主体材料,通过掺杂不同的锂盐获得聚合物固体电解质用于阳极键合进行封装。阳极键合对材料的要求主要是具有离子导电性,因此采用 X 射线小角衍射(small-angle X-ray scattering, SAXS)和傅里叶红外光谱( Fouriex transform infrared radiation spectroscopy, FTIR)对设计的高分子固体电解质的导电机理进行分析。研究结果表明:LiClO4的离解能更小;锂离子的迁移数更多;随着其质量分数的增加,电导率更高;通过键合结果发现,PEO-LiClO4和金属铝键合界面过渡层的产生是两者得以焊合的关键。
為瞭促進微機電繫統封裝技術的髮展,設計瞭應用聚氧化乙烯(polyethylene oxide,PEO)作為主體材料,通過摻雜不同的鋰鹽穫得聚閤物固體電解質用于暘極鍵閤進行封裝。暘極鍵閤對材料的要求主要是具有離子導電性,因此採用 X 射線小角衍射(small-angle X-ray scattering, SAXS)和傅裏葉紅外光譜( Fouriex transform infrared radiation spectroscopy, FTIR)對設計的高分子固體電解質的導電機理進行分析。研究結果錶明:LiClO4的離解能更小;鋰離子的遷移數更多;隨著其質量分數的增加,電導率更高;通過鍵閤結果髮現,PEO-LiClO4和金屬鋁鍵閤界麵過渡層的產生是兩者得以銲閤的關鍵。
위료촉진미궤전계통봉장기술적발전,설계료응용취양화을희(polyethylene oxide,PEO)작위주체재료,통과참잡불동적리염획득취합물고체전해질용우양겁건합진행봉장。양겁건합대재료적요구주요시구유리자도전성,인차채용 X 사선소각연사(small-angle X-ray scattering, SAXS)화부리협홍외광보( Fouriex transform infrared radiation spectroscopy, FTIR)대설계적고분자고체전해질적도전궤리진행분석。연구결과표명:LiClO4적리해능경소;리리자적천이수경다;수착기질량분수적증가,전도솔경고;통과건합결과발현,PEO-LiClO4화금속려건합계면과도층적산생시량자득이한합적관건。
To promote the development of micro-electro-mechanical system packaging technology, design the application of polyethylene oxide(PEO) as the main material, different lithium were doped into PEO to obtain polymer solid electrolyte material for anodic bonding package. Anodic bonding requirements of the material are mainly with ionic conductivity; therefore, small-angle X-ray scattering ( SAXS) and Fourier transform infrared radiation spectroscopy (FTIR) are used to analyze conductive mechanism of polymer solid electrolyte material. Results show that: dissociation energy of LiClO4 is small; the transport number of lithium ions is more; with the increase of the content, the electrical conductivity increases. Bonding shows that PEO-LiClO4 and aluminum bonding interface between the transition layers is the key to bond together.