绝缘材料
絕緣材料
절연재료
INSULATING MATERIALS
2014年
5期
41-44
,共4页
青双桂%赵浩融%王汝柯%黄孙息
青雙桂%趙浩融%王汝柯%黃孫息
청쌍계%조호융%왕여가%황손식
透明%有机硅%灌封胶%电子绝缘
透明%有機硅%灌封膠%電子絕緣
투명%유궤규%관봉효%전자절연
transparent%silicone%pouring sealant%electronic insulation
采用乙烯基硅树脂与含氢硅油、四甲基四乙烯基环四硅氧烷在铂金催化剂的条件下进行加成反应，制得无色透明的有机硅电子绝缘灌封胶，并对有机硅灌封胶的各项性能进行测试和分析。结果表明：有机硅灌封胶的硬度可调，力学性能优异，透光率高达95%，具有很好的耐热性，在400℃时质量损失仅为0.5%，可作为透光率要求高的电子元器件的灌封材料。
採用乙烯基硅樹脂與含氫硅油、四甲基四乙烯基環四硅氧烷在鉑金催化劑的條件下進行加成反應，製得無色透明的有機硅電子絕緣灌封膠，併對有機硅灌封膠的各項性能進行測試和分析。結果錶明：有機硅灌封膠的硬度可調，力學性能優異，透光率高達95%，具有很好的耐熱性，在400℃時質量損失僅為0.5%，可作為透光率要求高的電子元器件的灌封材料。
채용을희기규수지여함경규유、사갑기사을희기배사규양완재박금최화제적조건하진행가성반응，제득무색투명적유궤규전자절연관봉효，병대유궤규관봉효적각항성능진행측시화분석。결과표명：유궤규관봉효적경도가조，역학성능우이，투광솔고체95%，구유흔호적내열성，재400℃시질량손실부위0.5%，가작위투광솔요구고적전자원기건적관봉재료。
A transparent pouring sealant was prepared by addition reaction from vinyl silicone resin, hydrogen-containing silicone liquid, and tetravinyl tetramethylcyelo tetrasiloxane under Pt catalyst, and its properties were tested and analyzed. The results show that the hardness of the silicone pouring sealant can be adjusted, and the transmittance is up to 95%. The silicone pouring sealant has excellent mechani-cal properties and thermal stability, and its mass loss is only 0.5% at 400℃, which can be used as a high transmittance pouring sealant for electronic component.
