CAJ | 학술논문

采用电沉积(ED)方法在铜基上制得了由微球和微孔构成的微米级粗糙表面，用过硫酸钾和氢氧化钠的混合溶液处理后，在镀层上形成了Cu(OH)2纳米条/CuO微球的微纳米粗糙结构，再经过氟硅烷修饰得到超疏水表面。表面的静态接触角(CA)最大达到了158.5°。在3.5%(wt)的NaCl 溶液中用三电极体系测得了实验制备的超疏水表面的极化曲线，腐蚀电位比光滑铜表面正移了23 mV，腐蚀电流降低了2个数量级，缓蚀效率高达97.7%。为超疏水表面的实用性探索提供基础。
채용전침적(ED)방법재동기상제득료유미구화미공구성적미미급조조표면，용과류산갑화경양화납적혼합용액처리후，재도층상형성료Cu(OH)2납미조/CuO미구적미납미조조결구，재경과불규완수식득도초소수표면。표면적정태접촉각(CA)최대체도료158.5°。재3.5%(wt)적NaCl 용액중용삼전겁체계측득료실험제비적초소수표면적겁화곡선，부식전위비광활동표면정이료23 mV，부식전류강저료2개수량급，완식효솔고체97.7%。위초소수표면적실용성탐색제공기출。
A rough microstructural surface which consists of microspheres and microvoids was prepared by electrodeposition (ED) on copper substrate, and then oxidized by an aqueous solution of NaOH and K2S2O8. A hierarchical structure of CuO microspheres and Cu(OH)2 nanorod arrays is fabricated on the plating, and the surface with hierarchical structure finally possesses superhydrophobicity after chemical modification with fluoroalkylsilane(FAS). The static contact angles for water on the copper plating film are up to 158.5°. The corrosion inhibition property of superhydrophobic film in 3.5%(wt) NaCl solution was examined by polarization curve measurement, and results show that, comparing with smooth copper surface, the free corrosion potential of the superhydrophobic film is shifted positively by 23 mV, the corrosion current density is decreased by 2 orders of magnitude and its inhibition efficiency is up to 97.7%. This work provides fundamental knowledge for the applications of superhydrophobic surfaces.