电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2014年
11期
99-103
,共5页
钎焊%点涂%焊膏%工艺稳定性%影响因素分析%材料特性
釬銲%點塗%銲膏%工藝穩定性%影響因素分析%材料特性
천한%점도%한고%공예은정성%영향인소분석%재료특성
soldering%dispensing%solder paste%process stability%influential factor analysis%material properties
研究了焊膏材料特性、针头外形、点涂高度、滞留时间、回复高度、环境温度、针管内液面高度等对焊膏点涂工艺的影响。结果表明：影响焊膏可点涂性的材料特性主要包括焊球粒度、焊膏黏度和合金体积比；在点涂针头的选择上，尖锥形针头比常规直壁针管的针头更优；点涂高度对点涂焊膏量、点涂焊膏点的形貌、高度和直径均有显著影响，其中点涂焊膏量随点涂高度的增加而增加，变化过程可分为完全堵塞阶段、快速增长阶段和相对稳定阶段；此外，回复高度、环境温度、针管内液面高度均对焊膏点涂有显著影响，而滞留时间对焊膏点涂的影响不明显。
研究瞭銲膏材料特性、針頭外形、點塗高度、滯留時間、迴複高度、環境溫度、針管內液麵高度等對銲膏點塗工藝的影響。結果錶明：影響銲膏可點塗性的材料特性主要包括銲毬粒度、銲膏黏度和閤金體積比；在點塗針頭的選擇上，尖錐形針頭比常規直壁針管的針頭更優；點塗高度對點塗銲膏量、點塗銲膏點的形貌、高度和直徑均有顯著影響，其中點塗銲膏量隨點塗高度的增加而增加，變化過程可分為完全堵塞階段、快速增長階段和相對穩定階段；此外，迴複高度、環境溫度、針管內液麵高度均對銲膏點塗有顯著影響，而滯留時間對銲膏點塗的影響不明顯。
연구료한고재료특성、침두외형、점도고도、체류시간、회복고도、배경온도、침관내액면고도등대한고점도공예적영향。결과표명：영향한고가점도성적재료특성주요포괄한구립도、한고점도화합금체적비；재점도침두적선택상，첨추형침두비상규직벽침관적침두경우；점도고도대점도한고량、점도한고점적형모、고도화직경균유현저영향，기중점도한고량수점도고도적증가이증가，변화과정가분위완전도새계단、쾌속증장계단화상대은정계단；차외，회복고도、배경온도、침관내액면고도균대한고점도유현저영향，이체류시간대한고점도적영향불명현。
The effects of solder paste properties, nozzle shape, dispensing height, delay time, retracting height, ambient temperature and the level of material in the syringe on solder paste dispensing process were investigated. The results show that the material properties affecting the dispensability of solder paste include solder powder size, solder paste viscosity and the volume fraction of alloy. As for dispensing nozzle, the conical nozzle is better than the conventional straight-walled tip nozzle. The dispensing height has significant influence on dispensing mass, deposit shape, deposit height and deposit diameter, where the dispensing mass increases with increasing dispensing height, and the growth process can be divided into three stages: completely clogged stage, rapidly rising stage and relative steady stage. In addition, retracting height, ambient temperature and the level of material in the syringe all have significant influence on solder paste dispensing, whereas delay time do not influence solder paste dispensing significantly.
