CAJ | 학술논문

通过采用一系列与集成电路BGA（球栅阵列）、Flip Chip（倒装焊芯片）真实焊点体积接近的不同尺寸的典型“三明治”结构 Sn0.3Ag0.7Cu 低银无铅微互连焊点，基于动态力学分析的精密振动疲劳试验与微焊点疲劳断口形貌观察相结合的方法，研究了微焊点振动疲劳变形曲线的形成机制、裂纹萌生扩展与断裂机理、温度对振动疲劳行为的影响及微焊点振动疲劳行为的尺寸效应问题。结果表明，保持焊点直径恒定，随着焊点高度的减小，焊点的疲劳寿命增加，而疲劳断裂应变降低，同时焊点的疲劳断裂模式由韧性断裂转变为脆性断裂。
통과채용일계렬여집성전로BGA（구책진렬）、Flip Chip（도장한심편）진실한점체적접근적불동척촌적전형“삼명치”결구 Sn0.3Ag0.7Cu 저은무연미호련한점，기우동태역학분석적정밀진동피로시험여미한점피로단구형모관찰상결합적방법，연구료미한점진동피로변형곡선적형성궤제、렬문맹생확전여단렬궤리、온도대진동피로행위적영향급미한점진동피로행위적척촌효응문제。결과표명，보지한점직경항정，수착한점고도적감소，한점적피로수명증가，이피로단렬응변강저，동시한점적피로단렬모식유인성단렬전변위취성단렬。
Series of micro-interconnection Sn0.3Ag0.7Cu low silver sandwich structured solder joints with different sizes were adopted to conduct the vibration fatigue experiments on dynamic mechanical analyzer. The sizes of those solder joints were prepared very close to the real solder joint volume of BGA (ball grid array) and FC (flip chip) in IC (integrated circuit). Experimental results show that the vibration fatigue lives of the solder joints increase with the decreasing of joint height when keep joint diameters constant, but fatigue fracture strains of solder joints show the opposite trends. In addition, the failure modes of solder joints turn from ductile fracture to brittle fracture with the decreasing of joint height.