CAJ | 학술논문

采用单因素实验法，以镀液稳定性、镀速及镀层光亮度为指标，优化了化学镀铜液参数以提高镀液稳定性，并研究了添加剂对镀液电化学极化性能的影响。试验结果表明：随着CuSO4·5H2O和HCHO浓度的增加，镀液稳定性有所下降；适量的络合剂和稳定剂的加入能有效提高镀液稳定性。采用优化后的镀液施镀30 min，镀速为4.93μm/h；施镀后的镀液在80℃水浴中的稳定时间大于2 h；所得铜层为具有金属光泽的淡粉红色，铜颗粒排列紧密；镀铜层电阻率低至3.67×10-8Ω·m，铜层与基体之间的附着强度提高至10 N/mm2。
채용단인소실험법，이도액은정성、도속급도층광량도위지표，우화료화학도동액삼수이제고도액은정성，병연구료첨가제대도액전화학겁화성능적영향。시험결과표명：수착CuSO4·5H2O화HCHO농도적증가，도액은정성유소하강；괄량적락합제화은정제적가입능유효제고도액은정성。채용우화후적도액시도30 min，도속위4.93μm/h；시도후적도액재80℃수욕중적은정시간대우2 h；소득동층위구유금속광택적담분홍색，동과립배렬긴밀；도동층전조솔저지3.67×10-8Ω·m，동층여기체지간적부착강도제고지10 N/mm2。
The stability of bath, the speed and the brightness of coating were taken as indexes to optimize the bath of electroless copper plating through the single factor experiment method. Electrochemical test of plating solution was done to study the influence of additives on polarization performance of bath. The stability of solution decreases with the concentration of CuSO4·5H2O and HCHO increasing. The addition of appropriate complexing agent and stabilizers can effectively increase the stability of the plating solution. The copper deposition rate reaches to 4.93μm/h for plating 30 min. The stable time of plating bath is more than two hours in 80℃ water bath. Copper layer appears shiny pale pink, and copper particles are close together. The magnitude of copper layer resistivity is 3.67×10-8Ω·m. The adhesion strength between copper layer and substrate is up to 10 N/mm2.