电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2014年
11期
44-46
,共3页
郑星%黄海莹%陈颖%范敬辉%张凯
鄭星%黃海瑩%陳穎%範敬輝%張凱
정성%황해형%진영%범경휘%장개
环氧树脂%灌封%应力集中%力学性能%电路系统%固化时间
環氧樹脂%灌封%應力集中%力學性能%電路繫統%固化時間
배양수지%관봉%응력집중%역학성능%전로계통%고화시간
epoxy resin%encapsulation%stress concentration%mechanical properties%circuit system%curing time
灌封用环氧树脂除了要具备较强的抗冲击过载能力外,固化后还必须具有较小的内应力。通过控制环境温度,制备了灌封用环氧树脂,并对其力学性能进行了测量,分析了不同固化时间对材料弹性模量、抗压模量和屈服强度的影响。结果表明:固化90天的环氧树脂弹性模量比固化30天的环氧树脂下降了近23%,抗压强度增加了近24%。通过延长环氧树脂的固化时间能够有效减少材料内部的应力集中,从而降低对被灌封电路模块的影响。
灌封用環氧樹脂除瞭要具備較彊的抗遲擊過載能力外,固化後還必鬚具有較小的內應力。通過控製環境溫度,製備瞭灌封用環氧樹脂,併對其力學性能進行瞭測量,分析瞭不同固化時間對材料彈性模量、抗壓模量和屈服彊度的影響。結果錶明:固化90天的環氧樹脂彈性模量比固化30天的環氧樹脂下降瞭近23%,抗壓彊度增加瞭近24%。通過延長環氧樹脂的固化時間能夠有效減少材料內部的應力集中,從而降低對被灌封電路模塊的影響。
관봉용배양수지제료요구비교강적항충격과재능력외,고화후환필수구유교소적내응력。통과공제배경온도,제비료관봉용배양수지,병대기역학성능진행료측량,분석료불동고화시간대재료탄성모량、항압모량화굴복강도적영향。결과표명:고화90천적배양수지탄성모량비고화30천적배양수지하강료근23%,항압강도증가료근24%。통과연장배양수지적고화시간능구유효감소재료내부적응력집중,종이강저대피관봉전로모괴적영향。
Strong impact and small internal stress are required for epoxy resin used for encapsulation. The encapsulation epoxy resin was prepared by controlling the environment temperature, and the mechanical properties were measured. The influence of different curing time on the elastic modulus, compressive strength and yield strength of encapsulation epoxy resin were investigated. The results show that the elastic modulus of epoxy resin cured 90 days is 23 percent lower than the epoxy resin cured 30 days, and the compressive strength is 24 percent higher. The stress concentration is reduced effectively by extending the curing time, and the influence of stress concentration on circuit module also can be decreased.