电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2014年
11期
39-43
,共5页
余守玉%傅仁利%张捷%方军%李辰旸
餘守玉%傅仁利%張捷%方軍%李辰旸
여수옥%부인리%장첩%방군%리신양
溶胶-凝胶法%无铅玻璃%BaO-ZnO-B2O3-SiO2%厚膜浆料%晶相%润湿性
溶膠-凝膠法%無鉛玻璃%BaO-ZnO-B2O3-SiO2%厚膜漿料%晶相%潤濕性
용효-응효법%무연파리%BaO-ZnO-B2O3-SiO2%후막장료%정상%윤습성
sol-gel method%lead free glass%BaO-ZnO-B2O3-SiO2%thick-film paste%crystalline phase%wettability
采用溶胶-凝胶法制备适合Al 2 O 3、AlN陶瓷基板厚膜浆料用BaO-ZnO-B 2 O 3-SiO 2(BZBS)系无铅低熔玻璃粉。研究了pH值、温度对凝胶化过程的影响,并通过TG-DSC、XRD、SEM等手段分析了玻璃粉体性能、结构及形貌变化。结果表明:溶胶-凝胶法得到的BZBS玻璃粉经500℃热处理后其主要物相组成为非晶玻璃相和少量微晶,析出的主要晶相为BaCO 3以及少量Ba(CO 3)0.9(SiO 4)0.1和ZnO。溶胶-凝胶法制备的BZBS玻璃粉经850~900℃热处理,不仅能与Al 2 O 3陶瓷基板,还能与AlN陶瓷基板形成很好的润湿,可以作为陶瓷厚膜金属化电子浆料用玻璃粘结剂。
採用溶膠-凝膠法製備適閤Al 2 O 3、AlN陶瓷基闆厚膜漿料用BaO-ZnO-B 2 O 3-SiO 2(BZBS)繫無鉛低鎔玻璃粉。研究瞭pH值、溫度對凝膠化過程的影響,併通過TG-DSC、XRD、SEM等手段分析瞭玻璃粉體性能、結構及形貌變化。結果錶明:溶膠-凝膠法得到的BZBS玻璃粉經500℃熱處理後其主要物相組成為非晶玻璃相和少量微晶,析齣的主要晶相為BaCO 3以及少量Ba(CO 3)0.9(SiO 4)0.1和ZnO。溶膠-凝膠法製備的BZBS玻璃粉經850~900℃熱處理,不僅能與Al 2 O 3陶瓷基闆,還能與AlN陶瓷基闆形成很好的潤濕,可以作為陶瓷厚膜金屬化電子漿料用玻璃粘結劑。
채용용효-응효법제비괄합Al 2 O 3、AlN도자기판후막장료용BaO-ZnO-B 2 O 3-SiO 2(BZBS)계무연저용파리분。연구료pH치、온도대응효화과정적영향,병통과TG-DSC、XRD、SEM등수단분석료파리분체성능、결구급형모변화。결과표명:용효-응효법득도적BZBS파리분경500℃열처리후기주요물상조성위비정파리상화소량미정,석출적주요정상위BaCO 3이급소량Ba(CO 3)0.9(SiO 4)0.1화ZnO。용효-응효법제비적BZBS파리분경850~900℃열처리,불부능여Al 2 O 3도자기판,환능여AlN도자기판형성흔호적윤습,가이작위도자후막금속화전자장료용파리점결제。
A new type thick-film paste of BaO-ZnO-B2O3-SiO2(BZBS) lead free glass binder was prepared by a simple sol-gel approach, which can be used on Al2O3 and AlN ceramic substrates. The effects of pH value and temperature on the gelation process were investigated. The chemical features, structure and morphology of the as-prepared samples were characterized by TG-DSC, XRD and SEM. The results show that main crystalline phase of the BZBS glass is indexed to BaCO3 while still presented a tiny of Ba(CO3)0.9(SiO4)0.1 and ZnO after heating at 500℃. After heating above 850℃,the glass powder exhibites the excellent wetting properties on both Al 2 O 3 and AlN ceramic substrates, which indicates that the glass system can be used as glass binder of electronic pastes suit for thick film ceramic metallization.