功能材料
功能材料
공능재료
JOURNAL OF FUNCTIONAL MATERIALS
2014年
20期
20001-20006,20011
,共7页
袁腾%周显宏%王锋%涂伟萍%柯文皓
袁騰%週顯宏%王鋒%塗偉萍%柯文皓
원등%주현굉%왕봉%도위평%가문호
高导热率%低膨胀%导热填料%复合型%硅橡胶%热界面材料
高導熱率%低膨脹%導熱填料%複閤型%硅橡膠%熱界麵材料
고도열솔%저팽창%도열전료%복합형%규상효%열계면재료
high thermal conductivity%low expansion%thermally conductive filler%composites%silicone rubber%TIM
主要综述了高导热率低膨胀加成型硅橡胶及导热填料的研究进展。首先介绍了常见的导热填料及其基本性能,主要包括金属类、氧化物类、氮化物类、碳化物类等;详细描述了各类填料的性能特点,并指出了填料基本性能对导热系数的影响,主要包括填料的比例、尺寸、尺寸分布、形状及填料的表面性质等。其次详细介绍了提高导热系数的基本途径,主要包括导热机理介绍;基体材料研究;研发新型高性能导热填料;进行导热填料表面改性;对硅橡胶成型工艺进行优化等;然后介绍了降低热膨胀系数的一些基本途径,主要包括无机纳米粒子改性等。最后指出了目前该研究领域存在的一些基本问题及解决思路,并对未来的发展方向进行了展望。
主要綜述瞭高導熱率低膨脹加成型硅橡膠及導熱填料的研究進展。首先介紹瞭常見的導熱填料及其基本性能,主要包括金屬類、氧化物類、氮化物類、碳化物類等;詳細描述瞭各類填料的性能特點,併指齣瞭填料基本性能對導熱繫數的影響,主要包括填料的比例、呎吋、呎吋分佈、形狀及填料的錶麵性質等。其次詳細介紹瞭提高導熱繫數的基本途徑,主要包括導熱機理介紹;基體材料研究;研髮新型高性能導熱填料;進行導熱填料錶麵改性;對硅橡膠成型工藝進行優化等;然後介紹瞭降低熱膨脹繫數的一些基本途徑,主要包括無機納米粒子改性等。最後指齣瞭目前該研究領域存在的一些基本問題及解決思路,併對未來的髮展方嚮進行瞭展望。
주요종술료고도열솔저팽창가성형규상효급도열전료적연구진전。수선개소료상견적도열전료급기기본성능,주요포괄금속류、양화물류、담화물류、탄화물류등;상세묘술료각류전료적성능특점,병지출료전료기본성능대도열계수적영향,주요포괄전료적비례、척촌、척촌분포、형상급전료적표면성질등。기차상세개소료제고도열계수적기본도경,주요포괄도열궤리개소;기체재료연구;연발신형고성능도열전료;진행도열전료표면개성;대규상효성형공예진행우화등;연후개소료강저열팽창계수적일사기본도경,주요포괄무궤납미입자개성등。최후지출료목전해연구영역존재적일사기본문제급해결사로,병대미래적발전방향진행료전망。
Advances in the high thermal conductivity and low expansion rate silicone rubber and thermally con-ductive filler were summarized.First,the common thermally conductive filler and basic properties of thermally conductive filler were introduced,including metals,oxides,nitrides,carbides,etc..And the performance characteristics of various types of thermally conductive filler was described in detail and pointed out the influ-ence of the basic performance of the thermal conductivity on thermal conductivity,including filler ratio,size, size distribution,shape and surface properties of the filler and so on.Followed by a detailed description of the basic ways to improve thermal conductivity were given,including introduction of thermal conductivity mecha-nism;matrix materials research;development of new high-performance thermally conductive filler;conduct thermally conductive filler surface modification;silicone rubber molding process optimization,etc..Then some basic ways to reduce the coefficient of thermal expansion were introduced,including modification of inorganic nanoparticles and so on.Finally,some of the basic problems acurrently existing in the field and some ideas of solutions were advanced and the development trends were prospected.