CAJ | 학술논문

以CuO和La2 O3为掺杂剂，采用高能球磨法制备掺杂纳米SnO2粉体，再采用热挤压工艺制成银含量88％的纳米掺杂Ag／SnO2触头材料，利用扫描电子显微镜、电导率测试仪、显微硬度计对该触头材料进行了微观组织表征及性能测试，随后，利用该触头材料在10 A交流电流条件下进行电弧侵蚀性能测试．结果表明，触头材料中氧化物在银基体上分布均匀；Ag／SnO2触头材料的密度、硬度和电导率分别为9.7041g／cm3，104.2和75；电弧烧蚀速率为103.65μg／C ，并研究了熔层表面的微观组织结构．
이CuO화La2 O3위참잡제，채용고능구마법제비참잡납미SnO2분체，재채용열제압공예제성은함량88％적납미참잡Ag／SnO2촉두재료，이용소묘전자현미경、전도솔측시의、현미경도계대해촉두재료진행료미관조직표정급성능측시，수후，이용해촉두재료재10 A교류전류조건하진행전호침식성능측시．결과표명，촉두재료중양화물재은기체상분포균균；Ag／SnO2촉두재료적밀도、경도화전도솔분별위9.7041g／cm3，104.2화75；전호소식속솔위103.65μg／C ，병연구료용층표면적미관조직결구．
By high energy ball milling process ,the doped nano‐stannic anhydride(SnO2 ) powder was prepared with SnO2 as raw material ,CuO and La2 O3 as the doping agents .Then ,the contact material ,nano doped Ag/SnO2 with silver content 88% were prepared by the hot extrusion process .Furthermore ,the microstructures of the three materials above were characterized by scanning electron microscopy ,the conductivities ,hardnesses of the contact materials were measured by the conductivity meter ,the microhardness option and arc eroion test was tested under 10A AC current .The properties data shows that the density ,hardness and electrical conductivity of the Ag/SnO2 contact material are 9.704 1g/cm3 ,104.2 and 75 ,the arc erosion rate are 103.65μg/C ,the micro‐structure of the erosion surface is also analyzed .