CAJ | 학술논문

针对真空平板玻璃封接温度较低和玻璃与封接焊料要具有相匹配热膨胀系数的特点，实验选定PbO-TiO2-SiO2-Rx Oy 系封接焊料，采用真空熔接法侧边封接真空平板玻璃，利用 EBSD、EDS、XRD 方法分析了真空平板玻璃封接层的显微组织结构与物相组成，研究了封接层与玻璃界面处结合性与稳定性，并对真空平板玻璃封边进行了剪切强度与气密性实验，测定了真空平板玻璃封边处的剪切性能与气密性能，探讨了真空平板玻璃的封接机制.结果表明，封接层与玻璃之间的界面清晰，结合紧密，封接效果良好，封接层分为厚度在7~9μm 的界面反应润湿层与厚度在180~190μm的熔融层两个部分，界面处出现了元素迁移，并在界面反应润湿层生成了少量的PbTiO3.封接层无明显裂纹，存在少量不连通的气孔，但不影响其气密性能，封边气密性达到1．0×10－9 Pa?m3/s.
침대진공평판파리봉접온도교저화파리여봉접한료요구유상필배열팽창계수적특점，실험선정PbO-TiO2-SiO2-Rx Oy 계봉접한료，채용진공용접법측변봉접진공평판파리，이용 EBSD、EDS、XRD 방법분석료진공평판파리봉접층적현미조직결구여물상조성，연구료봉접층여파리계면처결합성여은정성，병대진공평판파리봉변진행료전절강도여기밀성실험，측정료진공평판파리봉변처적전절성능여기밀성능，탐토료진공평판파리적봉접궤제.결과표명，봉접층여파리지간적계면청석，결합긴밀，봉접효과량호，봉접층분위후도재7~9μm 적계면반응윤습층여후도재180~190μm적용융층량개부분，계면처출현료원소천이，병재계면반응윤습층생성료소량적PbTiO3.봉접층무명현렬문，존재소량불련통적기공，단불영향기기밀성능，봉변기밀성체도1．0×10－9 Pa?m3/s.
According to the characteristics of lower sealing temperature of the vacuum plate glass and coefficient of thermal expansion of phase match between the glass and the sealing solder,the experiment selected the seal-ing solder of the PbO-TiO2-SiO2-Rx Oy system.The edges of the vacuum plate glass were sealed with welding process under vacuum.The microstructure and phase composition of sealing edges of the vacuum plate glass were analyzed for EBSD,EDS and XRD.The associative property and stability at the interfaces between the sealing layer and the glass were studied.And the sealing solder of the vacuum plate glass was experimented with shear strength and air tightness,and measured shear performance and airtight performance.Sealing mechanism of the vacuum plate glass was explored.The results show that the interface between the glass and the sealing solder was clear,related closely and sealing effect was well.The sealing layer divides into the wetting layer for reacting with the interface and the melting layer,and the thickness was 7-9μm and 180-190μm respectively. The interface appears element migration.The wetting layer for reacting with the interface creates few PbTiO3 . The sealing layer barely exists obvious cracks and exists few disconnected pore,but not affect its airtight per-formance.Air tightness of the sealing solder reaches 1.0×10-9 Pa??m3/s.