中国有色金属学报
中國有色金屬學報
중국유색금속학보
THE CHINESE JOURNAL OF NONFERROUS METALS
2014年
10期
2668-2675
,共8页
铜电解精炼%添加剂%明胶-丙烯酰胺接枝共聚物%硫脲%明胶
銅電解精煉%添加劑%明膠-丙烯酰胺接枝共聚物%硫脲%明膠
동전해정련%첨가제%명효-병희선알접지공취물%류뇨%명효
copper electrorefining%additive%gelatin-acrylamide graft copolymer%thiourea%gelatin%acrylamide
采用过氧化合物为引发剂，以明胶和丙烯酰胺为原料合成得到明胶?丙烯酰胺接枝共聚物(PGAM)，并将PGAM作为铜电解添加剂应用于铜电解精炼。结果表明：PGAM能够替代硫脲用作铜电解添加剂，且对电解液中的漂浮阳极泥具有很好的絮凝作用。使用PGAM、明胶和骨胶作为添加剂时，在电解液温度为65℃、电流密度为235 A/m2的条件下，电解168 h后，所得高纯阴极铜中As、Sb和Bi含量分别为5.1×10?7、1.24×10?6、6.9×10?7，远低于使用硫脲、明胶和骨胶作为添加剂时所得阴极铜中相应杂质含量。电解所得阳极泥中，As、Sb和Bi含量分别为5.12%、4.04%和1.01%；而硫脲、明胶和骨胶为添加剂时，阳极泥中As、Sb和Bi含量分别为3.25%、2.20%和1.95%，表明PGAM有利于电解液中As和Sb的沉降。线性扫描伏安测试表明：PGAM在Cu2+还原过程中起极化作用，提高了Cu2+还原峰电流密度；与明胶和骨胶共同使用时，其极化作用减弱，峰电流密度降低。
採用過氧化閤物為引髮劑，以明膠和丙烯酰胺為原料閤成得到明膠?丙烯酰胺接枝共聚物(PGAM)，併將PGAM作為銅電解添加劑應用于銅電解精煉。結果錶明：PGAM能夠替代硫脲用作銅電解添加劑，且對電解液中的漂浮暘極泥具有很好的絮凝作用。使用PGAM、明膠和骨膠作為添加劑時，在電解液溫度為65℃、電流密度為235 A/m2的條件下，電解168 h後，所得高純陰極銅中As、Sb和Bi含量分彆為5.1×10?7、1.24×10?6、6.9×10?7，遠低于使用硫脲、明膠和骨膠作為添加劑時所得陰極銅中相應雜質含量。電解所得暘極泥中，As、Sb和Bi含量分彆為5.12%、4.04%和1.01%；而硫脲、明膠和骨膠為添加劑時，暘極泥中As、Sb和Bi含量分彆為3.25%、2.20%和1.95%，錶明PGAM有利于電解液中As和Sb的沉降。線性掃描伏安測試錶明：PGAM在Cu2+還原過程中起極化作用，提高瞭Cu2+還原峰電流密度；與明膠和骨膠共同使用時，其極化作用減弱，峰電流密度降低。
채용과양화합물위인발제，이명효화병희선알위원료합성득도명효?병희선알접지공취물(PGAM)，병장PGAM작위동전해첨가제응용우동전해정련。결과표명：PGAM능구체대류뇨용작동전해첨가제，차대전해액중적표부양겁니구유흔호적서응작용。사용PGAM、명효화골효작위첨가제시，재전해액온도위65℃、전류밀도위235 A/m2적조건하，전해168 h후，소득고순음겁동중As、Sb화Bi함량분별위5.1×10?7、1.24×10?6、6.9×10?7，원저우사용류뇨、명효화골효작위첨가제시소득음겁동중상응잡질함량。전해소득양겁니중，As、Sb화Bi함량분별위5.12%、4.04%화1.01%；이류뇨、명효화골효위첨가제시，양겁니중As、Sb화Bi함량분별위3.25%、2.20%화1.95%，표명PGAM유리우전해액중As화Sb적침강。선성소묘복안측시표명：PGAM재Cu2+환원과정중기겁화작용，제고료Cu2+환원봉전류밀도；여명효화골효공동사용시，기겁화작용감약，봉전류밀도강저。
The gelatin-acrylamide graft copolymer (PGAM) was synthesized by acrylamide and gelatin using peroxide as initiator, and the PGAM was applied in copper electrorefining as additive for the first time. The results show that this copolymer is an appropriate substitute for thiourea in copper electrorefining, and has significant flocculation effect on the floating slimes. When the graft copolymer was used as an additive combined with gelatin and bone glue, high-pure cathode copper can be obtained after electrolysis for 168 h at current density of 235 A/m2 and 65℃. The impurities of As, Sb and Bi in the cathode copper are 5.1×10?7, 1.24×10?6 and 6.9×10?7, respectively, which are much lower than those obtained by using the traditional additives of thiourea, gelatin and bone glue. The contents of As, Sb and Bi in the anode slimes are 5.12%, 4.04% and 1.01%, respectively, while those in the anode slime obtained using the thiourea as additive are 3.25%, 2.20% and 1.95%. The linear sweep voltammetry shows that the copolymer has polarization effect on Cu2+ reduction. In the meantime, the peak current density increases. When the copolymer was used with gelatin and bone glue, the polarization effect becomes weaker and peak current density decreases.
