激光杂志
激光雜誌
격광잡지
LASER JOURNAL
2014年
11期
129-130
,共2页
张婷%谢琪%王健%张舒平%王育庆%章莹%谢会斌
張婷%謝琪%王健%張舒平%王育慶%章瑩%謝會斌
장정%사기%왕건%장서평%왕육경%장형%사회빈
半导体激光%骨折%疼痛%康复
半導體激光%骨摺%疼痛%康複
반도체격광%골절%동통%강복
Low-level laser%Fracture%Pain%Rehabilitation
目的:观察半导体激光对骨折后疼痛的疗效。方法:骨折后疼痛患者66例,骨折已行复位固定,将患者随机分为单纯药物组,药物联合半导体激光组两组,单纯药物组使用美洛昔康,7.5mg/次,2次/日。联合激光组在此基础上加用半导体激光治疗,距离皮肤3cm,照射面积10cm2,每个痛点照射5min,1次∕日。两组均于治疗前、干预后第一天、第二天、第三天、一周、两周进行视觉模拟评分评价。结果:治疗前两组差异无统计学意义(P>0.05);干预2周后单纯药物组的VAS评分0.63±0.74,联合半导体激光组的VAS评分0.36±0.48,两组VAS评分差异有统计学意义(P<0.05)。结论:药物联合半导体激光比单纯药物治疗更能有效减轻骨折后疼痛。
目的:觀察半導體激光對骨摺後疼痛的療效。方法:骨摺後疼痛患者66例,骨摺已行複位固定,將患者隨機分為單純藥物組,藥物聯閤半導體激光組兩組,單純藥物組使用美洛昔康,7.5mg/次,2次/日。聯閤激光組在此基礎上加用半導體激光治療,距離皮膚3cm,照射麵積10cm2,每箇痛點照射5min,1次∕日。兩組均于治療前、榦預後第一天、第二天、第三天、一週、兩週進行視覺模擬評分評價。結果:治療前兩組差異無統計學意義(P>0.05);榦預2週後單純藥物組的VAS評分0.63±0.74,聯閤半導體激光組的VAS評分0.36±0.48,兩組VAS評分差異有統計學意義(P<0.05)。結論:藥物聯閤半導體激光比單純藥物治療更能有效減輕骨摺後疼痛。
목적:관찰반도체격광대골절후동통적료효。방법:골절후동통환자66례,골절이행복위고정,장환자수궤분위단순약물조,약물연합반도체격광조량조,단순약물조사용미락석강,7.5mg/차,2차/일。연합격광조재차기출상가용반도체격광치료,거리피부3cm,조사면적10cm2,매개통점조사5min,1차∕일。량조균우치료전、간예후제일천、제이천、제삼천、일주、량주진행시각모의평분평개。결과:치료전량조차이무통계학의의(P>0.05);간예2주후단순약물조적VAS평분0.63±0.74,연합반도체격광조적VAS평분0.36±0.48,량조VAS평분차이유통계학의의(P<0.05)。결론:약물연합반도체격광비단순약물치료경능유효감경골절후동통。
Objective: To assess the influence of low- level laser irradiation on the clinical function in patients with facture. Materials 66 patients with facture were randomly divided into drug group (control group) and assisted laser group (experimental group), with 33cases in each group. All the patients in two groups received the same speci-fication medication. While patients in experimental group additionally treated with OMEGA-2001 semiconductor la-ser (UK) for 5 minutes on each irradiation sites daily. The visual analogue scale( VAS) was used to assess the pain in two groups. Results:VAS scores in experimental group were significantly lower than that in control group( P<0.05 ). Conclusion: Early application of low-level semiconductor laser may be an alternative to relieve pain due to fracture in patients.