现代技术陶瓷
現代技術陶瓷
현대기술도자
ADVANCED CERAMICS
2014年
5期
17-20
,共4页
刘瑞祥%杨杰%隋学叶%张文苑%杜斌%周长灵
劉瑞祥%楊傑%隋學葉%張文苑%杜斌%週長靈
류서상%양걸%수학협%장문원%두빈%주장령
耐高温%陶瓷纤维%轻质%刚性隔热材料
耐高溫%陶瓷纖維%輕質%剛性隔熱材料
내고온%도자섬유%경질%강성격열재료
high temperature resistant%ceramic fiber%lightweight%rigid insulation material
针对新型高速飞行器对超高温热防护材料的需求,以超细直径耐高温陶瓷纤维和高温粘结剂为主要原料,通过纤维短切-湿法成型-高温热处理等工序制备了轻质高效隔热材料。对高温隔热材料的微观结构、热物理性能及力学性能进行了表征和分析。结果表明:短切纤维在隔热材料内部无序排列,形成了三维网络结构,具有较高的孔隙率,而且纤维与纤维搭接处具有良好的节点,因而材料具有一定的力学性能。材料在1500℃/h处理后,线收缩<2%,密度为0.35g/cm3的隔热材料厚度方向压缩强度>1MPa,室温热导率0.07W/m·K。
針對新型高速飛行器對超高溫熱防護材料的需求,以超細直徑耐高溫陶瓷纖維和高溫粘結劑為主要原料,通過纖維短切-濕法成型-高溫熱處理等工序製備瞭輕質高效隔熱材料。對高溫隔熱材料的微觀結構、熱物理性能及力學性能進行瞭錶徵和分析。結果錶明:短切纖維在隔熱材料內部無序排列,形成瞭三維網絡結構,具有較高的孔隙率,而且纖維與纖維搭接處具有良好的節點,因而材料具有一定的力學性能。材料在1500℃/h處理後,線收縮<2%,密度為0.35g/cm3的隔熱材料厚度方嚮壓縮彊度>1MPa,室溫熱導率0.07W/m·K。
침대신형고속비행기대초고온열방호재료적수구,이초세직경내고온도자섬유화고온점결제위주요원료,통과섬유단절-습법성형-고온열처리등공서제비료경질고효격열재료。대고온격열재료적미관결구、열물이성능급역학성능진행료표정화분석。결과표명:단절섬유재격열재료내부무서배렬,형성료삼유망락결구,구유교고적공극솔,이차섬유여섬유탑접처구유량호적절점,인이재료구유일정적역학성능。재료재1500℃/h처리후,선수축<2%,밀도위0.35g/cm3적격열재료후도방향압축강도>1MPa,실온열도솔0.07W/m·K。
According to a new type of high speed aircraft demand for ultra high temperature ther‐mal protection materials ,the ultrafine diameter resistance to high temperature ceramic fiber and high temperature binder were as main raw material ,and lightweight efficient thermal insulation material were prepared using the steps of the fiber chopped ,wet forming and heat treatment processes .The microstructure ,thermal physical properties and mechanical properties of high temperature thermal in‐sulation material were characterized and analyzed .The results show that :Disordered short cut fibers arranged in the insulation material ,formed a three -dimensional network structure ,provided with high porosity ,and the joint among fibers have good properties .So the material has good mechanical properties .The line shrinkage of material is below 1% in the condition of 1500℃ /h ,insulation mate‐rial of 0 .35g/cm3 density thickness direction compression strength is more than 1MPa ,and the room temperature thermal conductivity is 0 .07 W/m · K .