精密成形工程
精密成形工程
정밀성형공정
METAL FORMING TECHNOLOGY
2014年
6期
122-126
,共5页
王涛%甘贵生%胡志兰%唐明
王濤%甘貴生%鬍誌蘭%唐明
왕도%감귀생%호지란%당명
纳米 Ni%焊锡膏%IMC
納米 Ni%銲錫膏%IMC
납미 Ni%한석고%IMC
Ni nanoparticles%solders paste%IMC
目的：研究纳米 Ni 对 SnAg0.3Cu0.7无铅焊锡膏的焊点界面 IMC 影响。方法采用在助焊剂中添加纳米 Ni 颗粒，制备出纳米 Ni 颗粒增强的 SnAg0.3Cu0.7焊锡膏，分析纳米 Ni 在150益时效中对 IMC 的影响。结果在150益时效中界面 IMC 的厚度随着时效时间延长而增大，形貌变成平缓层状；添加 Ni 质量分数为0.025%时，对界面 IMC 几乎无影响，当添加质量分数为0.05%和0.1%的纳米 Ni 能促进 IMC 的生长，但抑制 Cu3 Sn 层的生长。结论通过添加纳米 Ni 颗粒，在150益时效中可促进 IMC 的生长，抑制 Cu3 Sn 层的生长。
目的：研究納米 Ni 對 SnAg0.3Cu0.7無鉛銲錫膏的銲點界麵 IMC 影響。方法採用在助銲劑中添加納米 Ni 顆粒，製備齣納米 Ni 顆粒增彊的 SnAg0.3Cu0.7銲錫膏，分析納米 Ni 在150益時效中對 IMC 的影響。結果在150益時效中界麵 IMC 的厚度隨著時效時間延長而增大，形貌變成平緩層狀；添加 Ni 質量分數為0.025%時，對界麵 IMC 幾乎無影響，噹添加質量分數為0.05%和0.1%的納米 Ni 能促進 IMC 的生長，但抑製 Cu3 Sn 層的生長。結論通過添加納米 Ni 顆粒，在150益時效中可促進 IMC 的生長，抑製 Cu3 Sn 層的生長。
목적：연구납미 Ni 대 SnAg0.3Cu0.7무연한석고적한점계면 IMC 영향。방법채용재조한제중첨가납미 Ni 과립，제비출납미 Ni 과립증강적 SnAg0.3Cu0.7한석고，분석납미 Ni 재150익시효중대 IMC 적영향。결과재150익시효중계면 IMC 적후도수착시효시간연장이증대，형모변성평완층상；첨가 Ni 질량분수위0.025%시，대계면 IMC 궤호무영향，당첨가질량분수위0.05%화0.1%적납미 Ni 능촉진 IMC 적생장，단억제 Cu3 Sn 층적생장。결론통과첨가납미 Ni 과립，재150익시효중가촉진 IMC 적생장，억제 Cu3 Sn 층적생장。
Objective To investigate the effects of Ni nanoparticles addition on the interfacial intermetallic compounds of SnAg0. 3Cu0. 7 lead-free solder paste. Methods The nanoparticle reinforced SnAg0. 3Cu0. 7 paste was prepared by adding Ni nanoparticles in the flux. The influence of Ni nanoparticles on IMC aging at 150 ℃ was analyzed. Results The study of interface IMC showed that during aging at 150 ℃ , the thickness of interface IMC increased with prolonged aging time and the morphology was changed into a planar type structure. The morphology of IMC was basically unchanged when the mass fraction of Ni nanoparticles was 0. 025% . Moreover, the growth of IMC was enhanced while that of Cu3 Sn was suppressed when the mass fractions of Ni nanoparticles were 0. 05% and 0. 1% , respectively. Conclusion The growth of IMC was en-hanced by adding Ni nanoparticles in the aging at 150 ℃ , while the growth of Cu3 Sn layer was suppressed.
