电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2014年
6期
330-333
,共4页
丁颖%董芸松%周岭%杭春进%飞景明
丁穎%董蕓鬆%週嶺%杭春進%飛景明
정영%동예송%주령%항춘진%비경명
表贴电阻%DIP%焊点可靠性%显微组织
錶貼電阻%DIP%銲點可靠性%顯微組織
표첩전조%DIP%한점가고성%현미조직
Surface mounting resistance%DIP%Reliability of joint%Microstructure
研究了表贴电阻及插装DIP器件的焊点可靠性。参照ECSS相关标准对装联后表贴电阻及插装DIP进行温循试验,借助光学显微镜及SEM电镜分析焊点内裂纹位置及影响因素。结果表明,DIP焊点裂纹产生于焊料与引脚的焊点上圆角处以及焊料与焊盘界面拐角处,PCB厚度对裂纹长度影响不大。表贴电阻裂纹产生于电极与焊料界面拐角处及下界面处,器件尺寸越大裂纹尺寸越长。
研究瞭錶貼電阻及插裝DIP器件的銲點可靠性。參照ECSS相關標準對裝聯後錶貼電阻及插裝DIP進行溫循試驗,藉助光學顯微鏡及SEM電鏡分析銲點內裂紋位置及影響因素。結果錶明,DIP銲點裂紋產生于銲料與引腳的銲點上圓角處以及銲料與銲盤界麵枴角處,PCB厚度對裂紋長度影響不大。錶貼電阻裂紋產生于電極與銲料界麵枴角處及下界麵處,器件呎吋越大裂紋呎吋越長。
연구료표첩전조급삽장DIP기건적한점가고성。삼조ECSS상관표준대장련후표첩전조급삽장DIP진행온순시험,차조광학현미경급SEM전경분석한점내렬문위치급영향인소。결과표명,DIP한점렬문산생우한료여인각적한점상원각처이급한료여한반계면괴각처,PCB후도대렬문장도영향불대。표첩전조렬문산생우전겁여한료계면괴각처급하계면처,기건척촌월대렬문척촌월장。
Study of surface mount resistance and through hole DIP device solder joint reliability. Analyze crack location and inlfuence factors via optics microscope and SEM after thermal cycling referring to ECSS criterion. The results show that cracks in DIP solder joint are located in interface of leader, solder and pad; and the thickness of PCB has no obvious inlfuence on reliability of joints. Cracks in surface mounting resistance solder joint are located in interface of the device and solder; and besides, the crack is longer for larger device.