CAJ | 학술논문

机箱的散热能力不仅会影响计算机的计算速度，也会影响各元器件的使用寿命。为了提高计算机封闭机箱的散热能力，依据湍流理论，建立了机箱冷却流场数学模型，并采用Icepak电子热设计专用软件对排风和进风方式进行了仿真优化。通过分析比较封闭机箱内电子元器件的温度、热流速度曲线、风流动轨迹图，获得了较为理想的温度场的冷却方式。优化结果表明，该优化方案实用、简单、准确，机箱散热效果好，为电子产品热设计提供了一个较为理想的热分析方法。
궤상적산열능력불부회영향계산궤적계산속도，야회영향각원기건적사용수명。위료제고계산궤봉폐궤상적산열능력，의거단류이론，건립료궤상냉각류장수학모형，병채용Icepak전자열설계전용연건대배풍화진풍방식진행료방진우화。통과분석비교봉폐궤상내전자원기건적온도、열류속도곡선、풍류동궤적도，획득료교위이상적온도장적냉각방식。우화결과표명，해우화방안실용、간단、준학，궤상산열효과호，위전자산품열설계제공료일개교위이상적열분석방법。
The heat dissipation capability of the chassis not only affects the operation speed of the computer, but also affects the life cycle of various components. In order to improve the heat dissipation capability of the enclosed chassis, based on turbulence theory the mathematical model of cooling flow field of the chassis is established. In addition, the simulation optimization is conducted for exhaust and air intake mode by adopting Icepak dedicated electronics thermal design software. Through analyzing and comparing the temperature, heat flux curve, airflow trajectory of electronic components inside chassis, the ideal cooling mode for temperature field is obtained. The result of optimization shows that this strategy is practicable, simple, and accurate for heat dissipation of the chassis. It provides ideal thermal analysis method for thermal design of electronic products.