电讯技术
電訊技術
전신기술
TELECOMMUNICATIONS ENGINEERING
2014年
11期
1544-1548
,共5页
相控阵雷达%多通道接收前端%C频段%微组装%微波多层板%小型化设计
相控陣雷達%多通道接收前耑%C頻段%微組裝%微波多層闆%小型化設計
상공진뢰체%다통도접수전단%C빈단%미조장%미파다층판%소형화설계
phased array radar%multi-channel receiver front-end%C-band%micro-assembly%microwave multilayer board%miniaturized design
基于微波多层板技术,通过对单片微波集成电路( MMIC)、微机电系统( MEMS)和低温共烧陶瓷( LTCC)滤波器等微组装工艺的优化和分析,使多通道接收前端进一步实现小型化设计和应用。同时,对电路和结构进行改进,使前端组件具有更好的幅相一致性和高隔离度。最终实现的C频段四通道接收前端尺寸为120 mm×50 mm×12 mm,幅相一致性分别小于±0.8 dB和±5o,通道间隔离度高于60 dBc。该设计方法的实现为小型化多通道接收前端的工程化应用提供了一种有效的解决方案。
基于微波多層闆技術,通過對單片微波集成電路( MMIC)、微機電繫統( MEMS)和低溫共燒陶瓷( LTCC)濾波器等微組裝工藝的優化和分析,使多通道接收前耑進一步實現小型化設計和應用。同時,對電路和結構進行改進,使前耑組件具有更好的幅相一緻性和高隔離度。最終實現的C頻段四通道接收前耑呎吋為120 mm×50 mm×12 mm,幅相一緻性分彆小于±0.8 dB和±5o,通道間隔離度高于60 dBc。該設計方法的實現為小型化多通道接收前耑的工程化應用提供瞭一種有效的解決方案。
기우미파다층판기술,통과대단편미파집성전로( MMIC)、미궤전계통( MEMS)화저온공소도자( LTCC)려파기등미조장공예적우화화분석,사다통도접수전단진일보실현소형화설계화응용。동시,대전로화결구진행개진,사전단조건구유경호적폭상일치성화고격리도。최종실현적C빈단사통도접수전단척촌위120 mm×50 mm×12 mm,폭상일치성분별소우±0.8 dB화±5o,통도간격리도고우60 dBc。해설계방법적실현위소형화다통도접수전단적공정화응용제공료일충유효적해결방안。
Based on microwave multilayer boards technology,a further miniaturized multi-channel receiver front-end is designed and successfully developed after optimization for micro-assembly process of mono-lithic microwave integrated circuit(MMIC),micro-electro-mechanical system(MEMS) and low tempera-ture cofired ceramic( LTCC) filters. Circuit and structure are improved in this design to obtain higher am-plitude-phase consistency and isolation in receiver front-end. Finally the size of the C-band four-channel receiver front-end is only 120 mmí50 mmí12 mm, amplitude and phase consistencies are better than±0. 8 dB and ±5o,the isolation between channels is better than 60 dBc. The proposed design method pro-vides an effctive solution for engineering application of miniaturized multi-channel receiver front-end.
