CAJ | 학술논문

以抛光垫抛光工艺为基础，研究出一套完整的新型无损边缘抛光工艺，成功实现了高精度光纤陀螺集成光学调制器LiNbO3芯片边缘的无损抛光。即在分析LiNbO3芯片边缘抛光过程中棱边损伤产生原因的基础上，提出3条解决措施：控制研抛浆料中的大颗粒；选择低亚表面损伤的抛光方式；抛光颗粒的大小接近或小于临界切削深度的2倍。加工工件棱边在1500×显微镜下观察无可见缺陷，芯片端面的表面粗糙度 Ra≤0．8 nm，表面平面度优于λ/2，满足了LiNbO3芯片无损边缘抛光要求。同时，该工艺方法具有较大的推广应用价值。
이포광점포광공예위기출，연구출일투완정적신형무손변연포광공예，성공실현료고정도광섬타라집성광학조제기LiNbO3심편변연적무손포광。즉재분석LiNbO3심편변연포광과정중릉변손상산생원인적기출상，제출3조해결조시：공제연포장료중적대과립；선택저아표면손상적포광방식；포광과립적대소접근혹소우림계절삭심도적2배。가공공건릉변재1500×현미경하관찰무가견결함，심편단면적표면조조도 Ra≤0．8 nm，표면평면도우우λ/2，만족료LiNbO3심편무손변연포광요구。동시，해공예방법구유교대적추엄응용개치。
To meet the requirements for defect‐free edge polishing of high‐precision fiber optic gyroscope integrated optic modulator LiNbO3 chips ,a new polishing process based on pad pol‐ishing was developed .According to the analysis on the causes for edge damage during the edge polishing ,three solutions were presented :controlling the big particles in polishing material , choosing the low sub‐face damage polishing and making the particles size close to or less than double of the critical cutting depth .With the new process ,the defect‐free edge polishing of LiNbO3 chips could be achieved and the results show that the edges under 1 500× microscope have no visible defect ,the chip end face roughness Ra is less than 0 .8 nm and the surface flat‐ness reaches better than λ/2 .Additional ,this polishing process has great application value .