CAJ | 학술논문

建立了微尺度 BGA焊点拉伸有限元分析模型，研究了拉伸加载条件下焊点高度、直径和焊盘直径对焊点拉伸应力应变的影响。结果表明：拉伸条件下，微尺度 BGA焊点顶端和底端的应力应变要大于焊点中间部分，焊点顶部和底部位置为高应力应变区域；在只单一改变焊点高度、直径和焊盘直径其中之一的前提下，随着焊点高度、直径和焊盘直径的增加，微尺度BGA焊点内的最大应力应变均相应减小；在置信度为90%的情况下，焊点直径对拉伸应力影响最大，其次是焊盘直径，最后是焊点高度；焊点直径对焊点拉伸应力具有显著影响，焊盘直径和焊点高度对焊点拉伸应力影响不显著。
건립료미척도 BGA한점랍신유한원분석모형，연구료랍신가재조건하한점고도、직경화한반직경대한점랍신응력응변적영향。결과표명：랍신조건하，미척도 BGA한점정단화저단적응력응변요대우한점중간부분，한점정부화저부위치위고응력응변구역；재지단일개변한점고도、직경화한반직경기중지일적전제하，수착한점고도、직경화한반직경적증가，미척도BGA한점내적최대응력응변균상응감소；재치신도위90%적정황하，한점직경대랍신응력영향최대，기차시한반직경，최후시한점고도；한점직경대한점랍신응력구유현저영향，한반직경화한점고도대한점랍신응력영향불현저。
Finite element analysis (FEA) models of microelectronic package miniature ball grid array (BGA) solder joints were set up. Effects of solder joint height, diameter and pad diameter on the stress and strain of solder joints were studied under tensile load. Results show that the stress and strain distributing in top and bottom of solder joints are greater than that in the middle of solder joints and the high stress and strain focus on the top and bottom of solder joint. If only changing one of the solder joint height, solder joint diameter and pad diameter, the maximum values of stress and strain in solder joints decrease with the increase of solder joint height, solder joint diameter and pad diameter. With 90%confidence, the solder joint diameter, pad diameter and solder joint height affect the stress of solder joints in a descending order, the solder joint diameter has certain effect on the stress of solder joint and that pad diameter and solder joint height have no significant effect on the stress of solder joint under tensile load.