电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2014年
7期
77-81
,共5页
唐宇%张鹏飞%吴志中%黄杰豪%李国元
唐宇%張鵬飛%吳誌中%黃傑豪%李國元
당우%장붕비%오지중%황걸호%리국원
引线键合%键合功率%键合压力%系统级封装%正交试验%失效机理
引線鍵閤%鍵閤功率%鍵閤壓力%繫統級封裝%正交試驗%失效機理
인선건합%건합공솔%건합압력%계통급봉장%정교시험%실효궤리
wire bonding%bonding power%bonding pressure%system-in-package%orthogonal test%failure mechanisms
选取0.2032 mm (8 mil)金线采用热压超声键合工艺进行烧球、拉力和线尾等一系列正交试验,分析各个键合参数对键合质量的影响。研究结果表明,最优的引线键合工艺窗口为键合温度180℃或190℃、键合功率35 mW、键合时间15 ms或20 ms、键合压力0.12 N、烧球电流3200 mA、烧球时间350μs和尾丝长度20μm。在影响键合质量的各因素中,键合功率和键合压力对键合质量的影响显著,过大的键合功率会引起键合区被破坏,键合强度降低,过小的键合功率因能量不足会引起欠键合,键合强度降低。过大的键合压力会引起键合球变形而导致键合强度降低,过小的键合压力因欠键合而导致键合强度降低。
選取0.2032 mm (8 mil)金線採用熱壓超聲鍵閤工藝進行燒毬、拉力和線尾等一繫列正交試驗,分析各箇鍵閤參數對鍵閤質量的影響。研究結果錶明,最優的引線鍵閤工藝窗口為鍵閤溫度180℃或190℃、鍵閤功率35 mW、鍵閤時間15 ms或20 ms、鍵閤壓力0.12 N、燒毬電流3200 mA、燒毬時間350μs和尾絲長度20μm。在影響鍵閤質量的各因素中,鍵閤功率和鍵閤壓力對鍵閤質量的影響顯著,過大的鍵閤功率會引起鍵閤區被破壞,鍵閤彊度降低,過小的鍵閤功率因能量不足會引起欠鍵閤,鍵閤彊度降低。過大的鍵閤壓力會引起鍵閤毬變形而導緻鍵閤彊度降低,過小的鍵閤壓力因欠鍵閤而導緻鍵閤彊度降低。
선취0.2032 mm (8 mil)금선채용열압초성건합공예진행소구、랍력화선미등일계렬정교시험,분석각개건합삼수대건합질량적영향。연구결과표명,최우적인선건합공예창구위건합온도180℃혹190℃、건합공솔35 mW、건합시간15 ms혹20 ms、건합압력0.12 N、소구전류3200 mA、소구시간350μs화미사장도20μm。재영향건합질량적각인소중,건합공솔화건합압력대건합질량적영향현저,과대적건합공솔회인기건합구피파배,건합강도강저,과소적건합공솔인능량불족회인기흠건합,건합강도강저。과대적건합압력회인기건합구변형이도치건합강도강저,과소적건합압력인흠건합이도치건합강도강저。
0.203 2 mm (8 mil) Au wire was used as the bonding wire,series of orthogonal tests such as the ball formation, the pull test, and the wire tail test were performed by ultrasonic thermo compression bonding process. The effects of wire bonding parameters on the bonding qualities were systematically analyzed. Results show that the optimized process parameter windows are bonding temperature is 180℃ or 190℃, bonding power is 35 mW, bonding time is 15 ms or 20 ms, bonding pressure is 0.12 N, electronic flame off current is 3 200 mA, electronic flame off time is 350μs and tail wire length is 20μm. In various factors affecting the wire bonding quality, bonding power and bonding pressure have a significant influence on bonding qualities. Results show that the bonding areas could be damaged by too high bonding power and the wire bonding strength reduces. Defective bonding could be caused by too small bonding power. The bonding ball deformation could be caused by too large bonding pressure and the bonding strength is also reduced by too small bonding pressure.