电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2014年
12期
74-77
,共4页
易江龙%张宇鹏%许磊%陈和兴%王昕昕
易江龍%張宇鵬%許磊%陳和興%王昕昕
역강룡%장우붕%허뢰%진화흥%왕흔흔
免洗助焊剂%Sn-Cu-Ni%无卤素%无银无铅焊料%腐蚀性%溶剂
免洗助銲劑%Sn-Cu-Ni%無滷素%無銀無鉛銲料%腐蝕性%溶劑
면세조한제%Sn-Cu-Ni%무서소%무은무연한료%부식성%용제
free-clean flux%Sn-Cu-Ni%halogen-free%silver and lead-free solder%corrosion%solvent
为了克服现有助焊剂在用于无银无铅焊料时存在的润湿性差、保护不良的缺点，通过对不同无卤素活性增强剂、复合溶剂的成分优化，结合绿色环保及无卤素的要求，设计合成了一种适用于 Sn-0.7Cu-0.05Ni 焊料用无卤素免洗助焊剂 NHC-1，并对其主要性能进行测试。结果表明，NHC-1助焊剂润湿优良，焊点光亮，焊前及焊后对PCB板均无腐蚀性，满足IPC J-STD-004A的各项指标要求。
為瞭剋服現有助銲劑在用于無銀無鉛銲料時存在的潤濕性差、保護不良的缺點，通過對不同無滷素活性增彊劑、複閤溶劑的成分優化，結閤綠色環保及無滷素的要求，設計閤成瞭一種適用于 Sn-0.7Cu-0.05Ni 銲料用無滷素免洗助銲劑 NHC-1，併對其主要性能進行測試。結果錶明，NHC-1助銲劑潤濕優良，銲點光亮，銲前及銲後對PCB闆均無腐蝕性，滿足IPC J-STD-004A的各項指標要求。
위료극복현유조한제재용우무은무연한료시존재적윤습성차、보호불량적결점，통과대불동무서소활성증강제、복합용제적성분우화，결합록색배보급무서소적요구，설계합성료일충괄용우 Sn-0.7Cu-0.05Ni 한료용무서소면세조한제 NHC-1，병대기주요성능진행측시。결과표명，NHC-1조한제윤습우량，한점광량，한전급한후대PCB판균무부식성，만족IPC J-STD-004A적각항지표요구。
In order to improve the properties of the exist flux for the silver and lead-free solder, through composition optimizations of halogen-free active-agents and solvents, combined with environmental protection and halogen-free requirements, the free-clean flux NHC-1 for the silver and lead-free solder Sn-0.7Cu-0.05Ni was designed and synthesized. Its main properties were tested. The results show that NHC-1 flux has excellent wetting ability, bright solder joints and no corrosion to PCB. All performances meet the requirements of the standard IPC J-STD-004A.
