CAJ | 학술논문

文章通过对Cu/Sn/Cu互连结构短时间施加超声波实现了Cu/Cu6Sn5/Cu或Cu/Cu3Sn/Cu高性能的焊接接头。由于超声空化效应的作用Cu/Sn固液界面产生了快速元素扩散从而加速了金属间化合物的形成。研究发现，空化气泡在固液界面附近坍塌会对固相铜界面造成严重的空化腐蚀，并且在液相锡中会形成铜过饱和区导致金属间化合物的快速形成。值得说明的是，这种室温超声键合所形成的金属间化合物接头具有良好的机械可靠性并且可实现超高温服役的优势。
문장통과대Cu/Sn/Cu호련결구단시간시가초성파실현료Cu/Cu6Sn5/Cu혹Cu/Cu3Sn/Cu고성능적한접접두。유우초성공화효응적작용Cu/Sn고액계면산생료쾌속원소확산종이가속료금속간화합물적형성。연구발현，공화기포재고액계면부근담탑회대고상동계면조성엄중적공화부식，병차재액상석중회형성동과포화구도치금속간화합물적쾌속형성。치득설명적시，저충실온초성건합소형성적금속간화합물접두구유량호적궤계가고성병차가실현초고온복역적우세。
Homogeneous Cu6Sn5 and Cu3Sn joints were formed in Cu/Sn foil/Cu interconnection system respectively, using ultrasonic bonding process for a short period of 3 seconds at room temperature. This ultrarapid development of full intermetallic compound (IMC) joints required an accelerated interdiffusion kinetics at the interface between liquid Sn and solid Cu which could be wholly attributed to the sonochemical effects induced by acoustic cavitation phenomenon. When bubble collapsed near the liquid/solid interface, excessive cavitation erosion was generated on the solid Cu surface, resulting in supersaturation of Cu in the liquid Sn and hence facilitating the formation of intermetallic phases as chemical reaction products. The resulted intermetallic joints performed high mechanical reliability.