CAJ | 학술논문

文中使用叠层技术制作了以环氧树脂/钛酸钡/聚酰亚胺为绝缘介质的PCB埋嵌电容器。制作的电容器容值与设计值之间误差在－4.0%到－6.0%之间。通过将电容器面积增加5%，电容器容值误差降低到了－1.1%以下。为了检测埋嵌电容器的可靠性，分别进行了260℃回流焊、高低温冷热冲击、85℃/85%RH及高压击穿测试。测试结果表明，以环氧树脂/钛酸钡/聚酰亚胺为绝缘介质的PCB埋嵌电容器有良好的环境可靠性，适合用于制作PCB埋嵌电容器。
문중사용첩층기술제작료이배양수지/태산패/취선아알위절연개질적PCB매감전용기。제작적전용기용치여설계치지간오차재－4.0%도－6.0%지간。통과장전용기면적증가5%，전용기용치오차강저도료－1.1%이하。위료검측매감전용기적가고성，분별진행료260℃회류한、고저온랭열충격、85℃/85%RH급고압격천측시。측시결과표명，이배양수지/태산패/취선아알위절연개질적PCB매감전용기유량호적배경가고성，괄합용우제작PCB매감전용기。
The embedded capacitors in PCB (Printed Circuit Board) were fabricated using commercial epoxy/BaTiO3/PI capacitor CCL in conventional PCB build-up process. Capacitance measuring demonstrated the tolerances of the obtained capacitors ranged from-4.0%to-6.0%, and special design to compensate the capacitor geometry signiifcantly decreased the tolerance to-1.1%. Relfow process at 260℃, high thermal cycling, 85℃/85%RH and high-voltage breakdown tests were performed to evaluate the reliability of embedded capacitors. It is summarized that the fabrication of epoxy/BaTiO3/PI composite embedded capacitors is successfully demonstrated using conventional PCB build-up processes, and their environmental reliability are evaluated to be excellent.