CAJ | 학술논문

发光二极管(LED)是一类可直接将电能转化为可见光和热等辐射能的发光器件。随着亮度和功率的不断提高，芯片键合材料成为解决大功率LED散热问题的关键技术之一。针对LED对芯片键合材料的性能要求，文章综述了LED芯片键合材料的种类、特点及发展现状，并重点介绍了环氧和有机硅材料的应用技术进展。
발광이겁관(LED)시일류가직접장전능전화위가견광화열등복사능적발광기건。수착량도화공솔적불단제고，심편건합재료성위해결대공솔LED산열문제적관건기술지일。침대LED대심편건합재료적성능요구，문장종술료LED심편건합재료적충류、특점급발전현상，병중점개소료배양화유궤규재료적응용기술진전。
LED is the abbreviation of light emitting diode, which is a kind of semiconductor materials that can transform electrical energy into visible light. With the improvement of LED brightness and efficiency, the die bonding materials have become one of the key technologies which are used to deal with heat management for LED. In this paper, the types, characteristics and development of LED die bonding materials developed for the performance requirements of LED packaging, especially the epoxy and silicone materials, were summarized.