CAJ | 학술논문

随着现代飞机性能的不断提高，电子设备的性能也大幅提升。与此同时，电子设备的组装密度越来越高，导致其热管理问题更加突出。针对高密度组装电子设备冷却散热技术面临的主要问题，从传热原理、冷却结构以及设计方法等诸多方面着手，探讨了从芯片级、模块级到设备级的有效冷却散热方式，对各种冷却散热方式的基本原理、优缺点以及适用范围进行了研究对比。在传统冷却散热技术的基础上，对新型冷却散热技术的发展趋势作出了展望，为未来电子设备冷却散热技术发展指明了方向。
수착현대비궤성능적불단제고，전자설비적성능야대폭제승。여차동시，전자설비적조장밀도월래월고，도치기열관리문제경가돌출。침대고밀도조장전자설비냉각산열기술면림적주요문제，종전열원리、냉각결구이급설계방법등제다방면착수，탐토료종심편급、모괴급도설비급적유효냉각산열방식，대각충냉각산열방식적기본원리、우결점이급괄용범위진행료연구대비。재전통냉각산열기술적기출상，대신형냉각산열기술적발전추세작출료전망，위미래전자설비냉각산열기술발전지명료방향。
Assembly density of electronic equipment becomes higher and higher as advancing of airplane performance which induces outstanding problems of thermal management. Aiming at cooling problems which high-density-assembly electronic equipment faced, efifcient cooling methods from chip, module to equipment are discussed in the paper. Basic principles, merits and drawbacks as well as scope of application about all cooling methods mentioned above are studied and compared. Finally, expectation about future cooling technique development trend of electronic equipment is provided.