功能材料
功能材料
공능재료
JOURNAL OF FUNCTIONAL MATERIALS
2012年
6期
806-808
,共3页
张建云%韩建平%张学辉%崔霞%周贤良
張建雲%韓建平%張學輝%崔霞%週賢良
장건운%한건평%장학휘%최하%주현량
Si/A1复合材料%无压熔渗%显微组织%性能
Si/A1複閤材料%無壓鎔滲%顯微組織%性能
Si/A1복합재료%무압용삼%현미조직%성능
Si/Al composite%pressureless infiltration%microstructure%properties
采用无压熔渗法制备Si/A1复合材料,研究了熔渗温度对所制备Si/Al复合材料Si相形貌的影响,对Si相间基体合金的凝固组织进行了分析,测试了Si/Al复合材料热膨胀系数、热导率及抗弯强度。结果表明,在相同熔渗时间下,随着熔渗温度升高,所制备Si/Al复合材料中Si相从颗粒状到形成网络状。Si相间的Al-Si基体合金中不再是典型的初生相和共晶组织,而是出现了类似离异共晶的结晶现象,即初晶Si和共晶Si是在原存的Si相上结晶长大。XRD分析显示在所制备复合材料中只有Si相和Al相。随着熔渗温度升高复合材料热膨胀系数、热导率以及抗弯强度均出现下降。
採用無壓鎔滲法製備Si/A1複閤材料,研究瞭鎔滲溫度對所製備Si/Al複閤材料Si相形貌的影響,對Si相間基體閤金的凝固組織進行瞭分析,測試瞭Si/Al複閤材料熱膨脹繫數、熱導率及抗彎彊度。結果錶明,在相同鎔滲時間下,隨著鎔滲溫度升高,所製備Si/Al複閤材料中Si相從顆粒狀到形成網絡狀。Si相間的Al-Si基體閤金中不再是典型的初生相和共晶組織,而是齣現瞭類似離異共晶的結晶現象,即初晶Si和共晶Si是在原存的Si相上結晶長大。XRD分析顯示在所製備複閤材料中隻有Si相和Al相。隨著鎔滲溫度升高複閤材料熱膨脹繫數、熱導率以及抗彎彊度均齣現下降。
채용무압용삼법제비Si/A1복합재료,연구료용삼온도대소제비Si/Al복합재료Si상형모적영향,대Si상간기체합금적응고조직진행료분석,측시료Si/Al복합재료열팽창계수、열도솔급항만강도。결과표명,재상동용삼시간하,수착용삼온도승고,소제비Si/Al복합재료중Si상종과립상도형성망락상。Si상간적Al-Si기체합금중불재시전형적초생상화공정조직,이시출현료유사리이공정적결정현상,즉초정Si화공정Si시재원존적Si상상결정장대。XRD분석현시재소제비복합재료중지유Si상화Al상。수착용삼온도승고복합재료열팽창계수、열도솔이급항만강도균출현하강。
Si/A1 composite was fabricated by pressureless infiltration. Effect of infiltration temperature on Si phase shape in prepared Si/A1 composite was investigated. The matrix alloy solidification microstructure in Siphase interspace was analyzed. The coefficient of thermal expansion, thermal conductivity and bending strength of Si/A1 composite were tested. The results show that at same infiltration time, with infiltration temperature increasing Si phase is from particle shape to network shape in prepared Si/A1 composite. The microstructure of A1-Si matrix alloy in Si phase interspace is no typieal primary phase and eutectie mierostructure. There is a phe-nomenon similar to the separate-eutectic microstructure. Primary Si phase and eutectic Si phase crystallize and grow at origin Si phase. XRD analyzing shows that there are Si phase and A1 phase in prepared Si/A1 composite. With infiltration temperature increasing, the coefficient of thermal expansion, thermal conductivity and bending strength of Si/A1 composite decrease.