CAJ | 학술논문

通过对SiC颗粒进行表面改性处理,并向Al基体中添加Si元素合金化采用热压烧结方法制备了Al-10Si-50%（质量分数）SiC复合材料,研究了复合材料的微观组织和导热性能。结果表明,复合材料中SiC颗粒在基体中分布均匀,复合材料组织致密;SiC-Al界面清晰、平直,无过渡层和其它附加物,复合材料界面结合良好;复合材料导热性能优异,其热导率可达189W/（m·K）,能够满足电子封装材料的日常使用要求。
통과대SiC과립진행표면개성처리,병향Al기체중첨가Si원소합금화채용열압소결방법제비료Al-10Si-50%（질량분수）SiC복합재료,연구료복합재료적미관조직화도열성능。결과표명,복합재료중SiC과립재기체중분포균균,복합재료조직치밀;SiC-Al계면청석、평직,무과도층화기타부가물,복합재료계면결합량호;복합재료도열성능우이,기열도솔가체189W/（m·K）,능구만족전자봉장재료적일상사용요구。
Al-10Si-50wt% SiC composite was fabricated by hot pressing sintering technique, through surface modification of SiC and adding Si into Al matrix. Results showed that the SiC particles distributed uniformly in the composite matrix, and overall composite was dense. The interface between SiC and Al was clear, straight and free from transient layer and other reactants. The interface connection was well and the composite showed excellent thermal conductivity as high as 189W/(m· K), which can meet the requirements of electronic packa- ging materials.