核电子学与探测技术
覈電子學與探測技術
핵전자학여탐측기술
NUCLEAR ELECTRONICS & DETECTION TECHNOLOGY
2014年
6期
788-793
,共6页
高飞%肖雪夫%倪宁%张力
高飛%肖雪伕%倪寧%張力
고비%초설부%예저%장력
高气压电离室%蒙特卡罗%MCNP%能量响应
高氣壓電離室%矇特卡囉%MCNP%能量響應
고기압전리실%몽특잡라%MCNP%능량향응
high pressure gas ionization chamber%Monte Carlo%MCNP%energy response
环境γ辐射监测用的高气压电离室要求具有较平的能量响应,以便提高其对环境γ辐射剂量率测量结果的准确性。论文利用MCNP蒙卡程序研究了高气压电离室对不同能量光子的响应特性,模拟研究了不同材料、不同厚度和不同面积能量补偿片对高气压电离室能量响应特性的作用规律,并在标准参考辐射场中进行刻度。根据其作用规律指导对高气压电离室外壁进行能量补偿的设计,解决了高气压电离室对不同能量γ射线响应不同的技术难题。计算和刻度结果表明:厚度为2 mm,屏蔽面积65%的锡片能够使高气压电离室在60 keV~1.5 MeV之间的响应相对于137 Cs的偏差在±30%以内,满足设计要求。
環境γ輻射鑑測用的高氣壓電離室要求具有較平的能量響應,以便提高其對環境γ輻射劑量率測量結果的準確性。論文利用MCNP矇卡程序研究瞭高氣壓電離室對不同能量光子的響應特性,模擬研究瞭不同材料、不同厚度和不同麵積能量補償片對高氣壓電離室能量響應特性的作用規律,併在標準參攷輻射場中進行刻度。根據其作用規律指導對高氣壓電離室外壁進行能量補償的設計,解決瞭高氣壓電離室對不同能量γ射線響應不同的技術難題。計算和刻度結果錶明:厚度為2 mm,屏蔽麵積65%的錫片能夠使高氣壓電離室在60 keV~1.5 MeV之間的響應相對于137 Cs的偏差在±30%以內,滿足設計要求。
배경γ복사감측용적고기압전리실요구구유교평적능량향응,이편제고기대배경γ복사제량솔측량결과적준학성。논문이용MCNP몽잡정서연구료고기압전리실대불동능량광자적향응특성,모의연구료불동재료、불동후도화불동면적능량보상편대고기압전리실능량향응특성적작용규률,병재표준삼고복사장중진행각도。근거기작용규률지도대고기압전리실외벽진행능량보상적설계,해결료고기압전리실대불동능량γ사선향응불동적기술난제。계산화각도결과표명:후도위2 mm,병폐면적65%적석편능구사고기압전리실재60 keV~1.5 MeV지간적향응상대우137 Cs적편차재±30%이내,만족설계요구。
The energy response of HPIC which is used for environmental radiation measurement should be flat, in order to improve its measurement accuracy of environment gamma-rays doserate.Using the MCNP Monte-Carlo program to study the response characteristics of the high-pressure ionization chamber for different energy photons, simulate the response characteristics law of energy response caused by different materials, different thicknesses and different areas of energy compensation sheet, the HPIC was then calibrated in standard refer-ence radiation field.The outdoor wall of high pressure ionization chamber is compensated according to the simu-lation results, to solve response technical problems of different energy gamma-rays.Results of MC calculation and experiment showed that Tin compensation patch of 2 mm thickness and 65% area can make the response deviation of HPIC within 30%to the 137 Cs from 60 keV to 1.5 MeV, can meet the design requirements.