国际生物医学工程杂志
國際生物醫學工程雜誌
국제생물의학공정잡지
INTERNATIONAL JOURNAL OF BIOMEDICAL ENGINEERING
2014年
2期
111-114
,共4页
王娟%王富平%段传英%马洪顺
王娟%王富平%段傳英%馬洪順
왕연%왕부평%단전영%마홍순
半导体激光%手术切口愈合%激光照射%氦氖激光器
半導體激光%手術切口愈閤%激光照射%氦氖激光器
반도체격광%수술절구유합%격광조사%양내격광기
Semiconductor laser%Incision healing%Laser irradiation%He-Ne laser
目的 观察635/808 nm双波长半导体激光与氦氖(He-Ne)激光低强度照射对手术切口愈合疗效的比较.方法 选择非恶性肿瘤手术患者168例,随机分为2组,试验组83例,手术切口予以半导体激光治疗仪低强度照射;阳性对照组85例,手术切口予以He-Ne激光治疗仪照射,以伤口红、肿、热、痛、渗出、裂开等临床表现和不良事件以及切口长度差距为指标观察2组手术切口愈合情况.结果 试验组和对照组切口愈合情况差异无统计学意义(P>0.05).结论 双波长半导体激光照射对手术切口愈合的疗效与He-Ne激光治疗效果相当.
目的 觀察635/808 nm雙波長半導體激光與氦氖(He-Ne)激光低彊度照射對手術切口愈閤療效的比較.方法 選擇非噁性腫瘤手術患者168例,隨機分為2組,試驗組83例,手術切口予以半導體激光治療儀低彊度照射;暘性對照組85例,手術切口予以He-Ne激光治療儀照射,以傷口紅、腫、熱、痛、滲齣、裂開等臨床錶現和不良事件以及切口長度差距為指標觀察2組手術切口愈閤情況.結果 試驗組和對照組切口愈閤情況差異無統計學意義(P>0.05).結論 雙波長半導體激光照射對手術切口愈閤的療效與He-Ne激光治療效果相噹.
목적 관찰635/808 nm쌍파장반도체격광여양내(He-Ne)격광저강도조사대수술절구유합료효적비교.방법 선택비악성종류수술환자168례,수궤분위2조,시험조83례,수술절구여이반도체격광치료의저강도조사;양성대조조85례,수술절구여이He-Ne격광치료의조사,이상구홍、종、열、통、삼출、렬개등림상표현화불량사건이급절구장도차거위지표관찰2조수술절구유합정황.결과 시험조화대조조절구유합정황차이무통계학의의(P>0.05).결론 쌍파장반도체격광조사대수술절구유합적료효여He-Ne격광치료효과상당.
Objective To compare healing effects of surgical incisions using 635 /808 nm dualwavelength semiconductor laser and He-Ne laser irradiation.Methods 168 cases of non-malignant tumor surgery patients were randomly divided into 2 groups:test group including 83 cases which were treated on the surgical incisions by laser irradiation of the semiconductor illumination with low-intensity power; positive control group with 85 cases treated with He-Ne laser.Observation was carried out on incision healing by the clinic manifestations including redness,heat,swelling,pain,exudation,wound open,adverse event and the incision length offset.Results There was no significant difference between experimental group and the control group on incision healing (P>0.05).Conclusions The treatment efficacy of the dual-wavelength semiconductor laser on surgical incisions healing is similar with that of the He-Ne laser.