电子测试
電子測試
전자측시
ELECTRONIC TEST
2013年
5期
275-276
,共2页
基底材质%电铸层%内应力%结合强度
基底材質%電鑄層%內應力%結閤彊度
기저재질%전주층%내응력%결합강도
basal material%electrodeposit%internal stress%bonding strength
采用冲液电沉积工艺,分别于紫铜和不锈钢两种不同材质基底制备金铸层,并研究基底材质对电铸层结构、内应力及结合强度的影响.结果表明:紫铜基底电铸层结构紧致、内应力低、结合强度高,而不锈钢基底电铸层恰巧相反.
採用遲液電沉積工藝,分彆于紫銅和不鏽鋼兩種不同材質基底製備金鑄層,併研究基底材質對電鑄層結構、內應力及結閤彊度的影響.結果錶明:紫銅基底電鑄層結構緊緻、內應力低、結閤彊度高,而不鏽鋼基底電鑄層恰巧相反.
채용충액전침적공예,분별우자동화불수강량충불동재질기저제비금주층,병연구기저재질대전주층결구、내응력급결합강도적영향.결과표명:자동기저전주층결구긴치、내응력저、결합강도고,이불수강기저전주층흡교상반.
Gold electrodeposit was prepared by flushing electrodeposition process based on red copper and stainless steel basement respectively, and its microstructure, internal stress as well as bonding strength was investigated and analyzed. The results show that the electrodeposit featuring compact structure, low internal stress and high bonding strength can be obtained using red copper basement.