CAJ | 학술논문

采用表面分析技术、失重法及电化学测试方法研究了 Q235钢在青霉菌(Penicillium)作用下的腐蚀行为和电化学特性.青霉菌在 Q235钢表面形成致密的生物膜和腐蚀产物沉积膜层.青霉菌促进 Q235钢的腐蚀,腐蚀类型为点蚀坑.青霉菌体系中试样表面膜经历由游离态变为固着态,由单层逐渐变为多层的过程;生物膜作用与细菌活性有关,当活性降低时微生物腐蚀促进作用也大幅降低.
채용표면분석기술、실중법급전화학측시방법연구료 Q235강재청매균(Penicillium)작용하적부식행위화전화학특성.청매균재 Q235강표면형성치밀적생물막화부식산물침적막층.청매균촉진 Q235강적부식,부식류형위점식갱.청매균체계중시양표면막경력유유리태변위고착태,유단층축점변위다층적과정;생물막작용여세균활성유관,당활성강저시미생물부식촉진작용야대폭강저.
@@@@The influenced corrosion behavior of Q235 carbon steel was investigated in the presence of Penicillium by using the surface analysis method, mass loss method, and electrochemical method. It is demonstrated that dense biofilms and depositing films of corrosion products form on the surface of Q235 carbon steel in the presence of Penicillium. Corrosion of Q235 carbon steel is evidently promoted and the corrosion morphology of Q235 carbon steel is pitting in Penicillium systems. The films on the surface of Q235 carbon steel changes through a complex process, from free state to solid state and single-layer to multilayer. The effect of the biofilm depends on bacterial activity, and the corrosion promotion of the biofilm decreases as the bacterial activity weakens.