计算机工程与应用
計算機工程與應用
계산궤공정여응용
COMPUTER ENGINEERING AND APPLICATIONS
2013年
9期
247-250
,共4页
一维下料%顺序启发式算法%动态规划算法%多线程技术%提高计算效率
一維下料%順序啟髮式算法%動態規劃算法%多線程技術%提高計算效率
일유하료%순서계발식산법%동태규화산법%다선정기술%제고계산효솔
one-dimensional cutting%sequential heuristic procedure%dynamic programming%multi-threading technology%improve the computing efficiency
讨论一维下料问题,对原有的基于顺序价值修正的启发式算法进行改进.每次使用动态规划算法求解当前最优排样方式的背包问题,保存多个价值最优的排样方式提供给 SHP 算法选择,修改对应的回退算法,提高算法的计算效率.综合考虑材料利用率和可重复次数,优先选择有利于后面排样方式生成的排样方式.在记录下的大量较优结果中,最终选取满足需要的排样方案进行使用.在计算过程中,结合多线程技术,进一步提高计算效率.实验结果表明,改进后的算法能够有效地提高材料利用率,简化切割方式,在计算时间上优势明显.
討論一維下料問題,對原有的基于順序價值脩正的啟髮式算法進行改進.每次使用動態規劃算法求解噹前最優排樣方式的揹包問題,保存多箇價值最優的排樣方式提供給 SHP 算法選擇,脩改對應的迴退算法,提高算法的計算效率.綜閤攷慮材料利用率和可重複次數,優先選擇有利于後麵排樣方式生成的排樣方式.在記錄下的大量較優結果中,最終選取滿足需要的排樣方案進行使用.在計算過程中,結閤多線程技術,進一步提高計算效率.實驗結果錶明,改進後的算法能夠有效地提高材料利用率,簡化切割方式,在計算時間上優勢明顯.
토론일유하료문제,대원유적기우순서개치수정적계발식산법진행개진.매차사용동태규화산법구해당전최우배양방식적배포문제,보존다개개치최우적배양방식제공급 SHP 산법선택,수개대응적회퇴산법,제고산법적계산효솔.종합고필재료이용솔화가중복차수,우선선택유리우후면배양방식생성적배양방식.재기록하적대량교우결과중,최종선취만족수요적배양방안진행사용.재계산과정중,결합다선정기술,진일보제고계산효솔.실험결과표명,개진후적산법능구유효지제고재료이용솔,간화절할방식,재계산시간상우세명현.
This paper discusses the One-Dimensional Cutting Stock Problem, improves the original heuristic algorithm based on Sequential Value Correction. Every time it uses dynamic programming algorithm to solve the bounded knapsack problem of opti-mal cutting pattern and preserves many cutting patterns of best value to provide for SHP algorithm selection, modifies the corre-sponding backtrack algorithm to improve the computing efficiency. It comprehensively considers the utilization rate and repeatable times of materials, gives priority to choose the pattern helpful to generate the one behind. From the lots of better results recorded, it finally chooses the scheme meeting needs to use. In the calculating process, it combines with the multi-threading technology to further improve computational efficiency. The experiment results indicate that the improved algorithm can improve the material utilization ratio effectively, simplify the cutting process, and have an obvious advantage in computation time.