CAJ | 학술논문

随着电子产品无铅化、无卤化的发展,印制电路板(PCB)对覆铜板的要求越来越高,主要表现在耐热性和可靠性,特别是高多层PCB密集BGA的爆板分层现象越来越频繁.文章研究了一种高耐热、低CTE的覆铜箔层压板以及粘结片材料,针对该材料进行高多层PCB耐热性和通孔可靠性应用研究,包括24层厚4.0mm通讯背板和20L通讯背板的IST测试0.8mm 间距密集BGA处在经受6次无铅回流焊后无分层爆板等失效情况出现,表现出优良的高多层适应性.该材料的主要特点为Tg(DMA)>180℃,Td(5% Loss)>350℃,Z轴热膨胀系数α1<45μm/(m·℃),α2<220μm/(m·℃).
수착전자산품무연화、무서화적발전,인제전로판(PCB)대복동판적요구월래월고,주요표현재내열성화가고성,특별시고다층PCB밀집BGA적폭판분층현상월래월빈번.문장연구료일충고내열、저CTE적복동박층압판이급점결편재료,침대해재료진행고다층PCB내열성화통공가고성응용연구,포괄24층후4.0mm통신배판화20L통신배판적IST측시0.8mm 간거밀집BGA처재경수6차무연회류한후무분층폭판등실효정황출현,표현출우량적고다층괄응성.해재료적주요특점위Tg(DMA)>180℃,Td(5% Loss)>350℃,Z축열팽창계수α1<45μm/(m·℃),α2<220μm/(m·℃).
With the development of lead free and halogen free electronics products, printed circuit board (PCB) has higher and higher requirements on copper clad laminate, mainly in heat resistance and through hole reliability, especially for high layer count PCB, higher risk of failure in high density BGA is commonly found. This article introduces a novel high thermal reliability and low Z-CTE copper clad laminate material, which is suitable for high layer count PWBs application, having superior performance in high layer count PCB as evaluated here, which can pass the 24 layer 4.0mm thick 0.8mm pitch BGA 5X lead free reflow test. The major features of this material are Tg(DMA)>180℃, Td(5%Loss)>350℃, Z-CTE 1<45μm/(m·℃), 2<220μm/(m·℃).