酸性蚀刻线宽补偿与蚀刻因子、铜厚及线间距关系研究
산성식각선관보상여식각인자、동후급선간거관계연구
Research on relationships between line width compensation&e-factor/copper thickness/line space in acid-subtractive process
  • 万方数据
    印制电路信息 인제전로신식
    PRINTED CIRCUIT INFORMATION
    2013年 4期 92-103 ,共12页

    彭镜辉%何平%韩龙

    팽경휘%하평%한룡

    蚀刻因子%补偿量%铜厚%线间距%动态补偿 蝕刻因子%補償量%銅厚%線間距%動態補償
    식각인자%보상량%동후%선간거%동태보상
    E-factor%Compensation%Copper Thickness%Space%Dynamic Compensation
    文章从蚀刻因子,铜厚以及线间距入手,研究了线宽补偿和这三个因素的关系,并使用公式表述,从而可指导酸性蚀刻减成法线宽补偿的工程设计,并为后续研究103μm (3oz/ft2)以上厚铜板的补偿提供了方向.
    문장종식각인자,동후이급선간거입수,연구료선관보상화저삼개인소적관계,병사용공식표술,종이가지도산성식각감성법선관보상적공정설계,병위후속연구103μm (3oz/ft2)이상후동판적보상제공료방향.
    This paper has done a research on line width compensation of subtractive process in PCB industry. Pointing out the relationships between compensation and E-factor, copper thickness and line space, it uses 3 formulas to express them. The results do not only supply us guidance for compensation design before manufacturing, but also show us a research direction about thick copper board’s compensation.
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