印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
4期
125-129
,共5页
贴膜%干膜结合力
貼膜%榦膜結閤力
첩막%간막결합력
Dry Film lamination%Dry Film Combination Dry film Combination Analysis and Improvement in the Film Lamination Process of the Image Transition
文章先分析了图形转移中贴膜过程受力并从中总结出干膜结合力产生的理论基础,又从工艺上分析总结出提升合适干膜结合力的理论,接着从工艺流程上分析总结出如何实现提升合适干膜结合力的机理,再用实验验证了提升合适干膜结合力机理的正确性;通过提升合适干膜结合力,为PCB板制造过程提高板件良率和降低报废成本提供了控制的理论依据;本理论能指导PCB行业贴膜制作流程和提高贴膜制造技术.
文章先分析瞭圖形轉移中貼膜過程受力併從中總結齣榦膜結閤力產生的理論基礎,又從工藝上分析總結齣提升閤適榦膜結閤力的理論,接著從工藝流程上分析總結齣如何實現提升閤適榦膜結閤力的機理,再用實驗驗證瞭提升閤適榦膜結閤力機理的正確性;通過提升閤適榦膜結閤力,為PCB闆製造過程提高闆件良率和降低報廢成本提供瞭控製的理論依據;本理論能指導PCB行業貼膜製作流程和提高貼膜製造技術.
문장선분석료도형전이중첩막과정수력병종중총결출간막결합력산생적이론기출,우종공예상분석총결출제승합괄간막결합력적이론,접착종공예류정상분석총결출여하실현제승합괄간막결합력적궤리,재용실험험증료제승합괄간막결합력궤리적정학성;통과제승합괄간막결합력,위PCB판제조과정제고판건량솔화강저보폐성본제공료공제적이론의거;본이론능지도PCB행업첩막제작류정화제고첩막제조기술.
This thesis analyzed the film lamination process, and concluded the theoretical basis for the dry film combination. On the basis of the manufactruring status, the theortic of the dry film combination raising up was sumarized and how to increase the combination was also concluded. The theoretic was verified by the experiments and which then be prooofed correct .This thesis provided the theoretical base for the yield improcement and cost reducement by increase the combination of the dry film. The thesis can be a guide for the lamination process of the PCB industry and the lamination process improcement.