印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
4期
174-179
,共6页
李喜琪%覃贤德%尹同芳%宋刘洋
李喜琪%覃賢德%尹同芳%宋劉洋
리희기%담현덕%윤동방%송류양
紫外激光%盲孔%钻孔%扫描方法
紫外激光%盲孔%鑽孔%掃描方法
자외격광%맹공%찬공%소묘방법
UV Laser%Blind Via%Drilling%Scan Method
微盲孔钻孔技术已经成为制约HDI和IC载板技术提高的瓶颈之一.紫外激光(UV)加工技术具有能量高、精度高的优势,成了激光钻孔研究的新热点.文章主要研究了UV激光盲孔钻孔中的同心圆方法、摇摆环(wobble)方法.实验结果表明,在高斯光束的情况下,利用同心圆扫描的方法进行100mm盲孔钻孔时,底部平均深度为(65.24±1.26)mm,孔径比为0.80±0.016;利用摇摆环方法时,底部平均深度控制在(64.40±0.91)mm,孔径比为0.76±0.031.实验结果表明,这两种方法都可以获得满足加工要求的微小盲孔.
微盲孔鑽孔技術已經成為製約HDI和IC載闆技術提高的瓶頸之一.紫外激光(UV)加工技術具有能量高、精度高的優勢,成瞭激光鑽孔研究的新熱點.文章主要研究瞭UV激光盲孔鑽孔中的同心圓方法、搖襬環(wobble)方法.實驗結果錶明,在高斯光束的情況下,利用同心圓掃描的方法進行100mm盲孔鑽孔時,底部平均深度為(65.24±1.26)mm,孔徑比為0.80±0.016;利用搖襬環方法時,底部平均深度控製在(64.40±0.91)mm,孔徑比為0.76±0.031.實驗結果錶明,這兩種方法都可以穫得滿足加工要求的微小盲孔.
미맹공찬공기술이경성위제약HDI화IC재판기술제고적병경지일.자외격광(UV)가공기술구유능량고、정도고적우세,성료격광찬공연구적신열점.문장주요연구료UV격광맹공찬공중적동심원방법、요파배(wobble)방법.실험결과표명,재고사광속적정황하,이용동심원소묘적방법진행100mm맹공찬공시,저부평균심도위(65.24±1.26)mm,공경비위0.80±0.016;이용요파배방법시,저부평균심도공제재(64.40±0.91)mm,공경비위0.76±0.031.실험결과표명,저량충방법도가이획득만족가공요구적미소맹공.
The micro blind via drilling method has become the bottleneck of the PCB and HDI development. UV laser machine becomes a research hotspot of the blind via drilling because of its high energy and accuracy. This paper researches on the concentric scanning method and the wobble scanning method for the UV laser blind via drilling. 100um blind via were drilled by this two methods. The results show that, when using the concentric scanning method, the average height of the bottom layer and diameter ratio of upper and lower are (65.24 ±1.26)μm and 0.80±0.016, respectively;When using the wobble method, the corresponding values are (64.40± 0.91)μm and 0.76±0.031, respectively. Both scanning methods are in the Gaussian light environment. These results also show that both methods are qualified for the UV laser blind via drilling.
