CAJ | 학술논문

为实现高密度互连印制板(HDI)制作的质量与成本最优化,实验以利用半固化片压合时直接塞埋孔方式代替传统树脂塞孔工艺制作了6层的HDI板,对层压板埋孔处进行了凹陷度、介质层厚度及耐热性能测试,并比较了树脂塞埋孔和半固化片直接塞埋孔两种工艺对板的尺寸涨缩影响.实验得出:采用半固化片直接压合塞埋孔方法制作平均孔密度低于31个/cm2,芯板厚度≤0.5mm,埋孔孔径≤0.3mm的HDI板,其可靠性等各项性能指标均能满足工艺要求.且此法不需要磨板流程从而避免了磨板对板面造成的尺寸涨缩,实际生产中,可大大降低生产成本、提高生产效率.
위실현고밀도호련인제판(HDI)제작적질량여성본최우화,실험이이용반고화편압합시직접새매공방식대체전통수지새공공예제작료6층적HDI판,대층압판매공처진행료요함도、개질층후도급내열성능측시,병비교료수지새매공화반고화편직접새매공량충공예대판적척촌창축영향.실험득출:채용반고화편직접압합새매공방법제작평균공밀도저우31개/cm2,심판후도≤0.5mm,매공공경≤0.3mm적HDI판,기가고성등각항성능지표균능만족공예요구.차차법불수요마판류정종이피면료마판대판면조성적척촌창축,실제생산중,가대대강저생산성본、제고생산효솔.
To optimize the quality and the fabricating cost of HDI board, the method of prepreg direct plugging buried hole without resin was adopted to 6-layer HDI boards in this study. The concavity, the dielectric layer thickness and the thermal stabilities in buried hole area of laminated boards were investigated. Further more, the magnification influence between two approaches by resin and prepreg plug buried holes were compared. The results demonstrated that the method of direct plugging hole with prepreg can produce the HDI board whose average hole density under 37/cm2and the thickness of the core board and the diameter of blind hole is less than 0.5 mm and 0.3 mm, respectively. The performance index of laminated board such as reliability can meet the technical requirements. The stretching caused by grinding process was avoided by this way. It can be cost-effective and efficiency in practical production.