CAJ | 학술논문

文章主要介绍了一种HDI板埋孔压合塞孔新的工艺方法,以及此方法的成本优势.本方法的主要原理是:压合时使用一种高含胶量、高流动性的半固化片根据树脂流动性的特点对埋孔进行塞孔填充.通过实验研究,当板厚≤2.0mm、埋孔孔径≤0.3mm时,压合塞孔饱满良好、无空洞、无气泡.并将此方法的生产工艺流程与传统的树脂塞孔生产工艺流程进行对比,发现此方法的工艺流程更加简单优化,成本优势更好.
문장주요개소료일충HDI판매공압합새공신적공예방법,이급차방법적성본우세.본방법적주요원리시:압합시사용일충고함효량、고류동성적반고화편근거수지류동성적특점대매공진행새공전충.통과실험연구,당판후≤2.0mm、매공공경≤0.3mm시,압합새공포만량호、무공동、무기포.병장차방법적생산공예류정여전통적수지새공생산공예류정진행대비,발현차방법적공예류정경가간단우화,성본우세경호.
The paper mainly present a new technology of filling HDI buried holes by laminating and its cost advantage of the new technology. The main principle of the method is to fill HDI buried holes according to fluidity of resin by means of using high resin content, high resin fluidity prepreg during lamination. When thickness of board is less than or equal to 2.0mm, diameter of buried holes is less than or equal to 0.3mm,there is no cavity and air bubble after lamination through experiment research. In addition, we compare this new manufacturing process with traditional manufacturing process of resin filling, finding that this new technology process is more simplified and optimized, the advantage of cost is better.