印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
4期
213-217
,共5页
印制板%混压%混合结构%高频%高速
印製闆%混壓%混閤結構%高頻%高速
인제판%혼압%혼합결구%고빈%고속
PCB%Mixed Lamination%Hybrid Construction%High-Frequency%High-Speed
随着信息技术的飞跃发展,为满足信号传送高频高速化、散热导热快速化以及生产成本最低化,各种形式的混压结构多层板设计与应用方兴未艾.文章概述了各类陶瓷料与FR-4不对称设计、局部埋入高频板材、局部埋入高密度子板、混压阶梯设计、埋嵌铜块或碳复合材料或散热粘结片的混压散热设计、混压复合材料嵌入孔设计等方面的混压技术及其相应品质改善问题;同时重点阐述了混压介质中的微带线在插损、眼图表征与信号串扰方面的性能表现,以及此类混压多层板板翘改善方法及其实际应用效果.
隨著信息技術的飛躍髮展,為滿足信號傳送高頻高速化、散熱導熱快速化以及生產成本最低化,各種形式的混壓結構多層闆設計與應用方興未艾.文章概述瞭各類陶瓷料與FR-4不對稱設計、跼部埋入高頻闆材、跼部埋入高密度子闆、混壓階梯設計、埋嵌銅塊或碳複閤材料或散熱粘結片的混壓散熱設計、混壓複閤材料嵌入孔設計等方麵的混壓技術及其相應品質改善問題;同時重點闡述瞭混壓介質中的微帶線在插損、眼圖錶徵與信號串擾方麵的性能錶現,以及此類混壓多層闆闆翹改善方法及其實際應用效果.
수착신식기술적비약발전,위만족신호전송고빈고속화、산열도열쾌속화이급생산성본최저화,각충형식적혼압결구다층판설계여응용방흥미애.문장개술료각류도자료여FR-4불대칭설계、국부매입고빈판재、국부매입고밀도자판、혼압계제설계、매감동괴혹탄복합재료혹산열점결편적혼압산열설계、혼압복합재료감입공설계등방면적혼압기술급기상응품질개선문제;동시중점천술료혼압개질중적미대선재삽손、안도표정여신호천우방면적성능표현,이급차류혼압다층판판교개선방법급기실제응용효과.
With rapid development and wide use of information technology, design and application of hybrid multilayer PCB are demanded to meet the conditions of signal transmission with high speed or high frequency and to reduce production cost. This paper wants to summarize the pressing technology and the quality improvement of asymmetric mixed lamination by hydrocarbon/ceramic and FR-4, partial hybrid high-frequency materials or mother-board and sub-board, thermal management with embedded coin or carbon composite material or thermal bonding sheet and sub-composited via. The problem of signal transmission such as insertion loss, eye pattern and signal crosstalk of mixed dielectric striplines and the method and results in improving warpage of these high-frequency hybrid multilayer PCB are emphatically introduced at the same.