CAJ | 학술논문

文章介绍了一种表征电镀铜添加剂的副产物的方法.具体方法是恒流法,在一恒定的电流密度下,利用阴极电位变化值Δφ的大小来进行添加剂的副产物的表征.首先,采用此方法分析电镀液各组分不同浓度对Δφ的影响,发现各组分浓度在控制范围内变化时,Δφ小于某一定值;然后,通过空气氧化、H2O2氧化、电解的方法产生副产物,Δφ值有明显的增大;最后,通过不同的处理方式后,Δφ值有明显的降低,大部分的副产物被除去.
문장개소료일충표정전도동첨가제적부산물적방법.구체방법시항류법,재일항정적전류밀도하,이용음겁전위변화치Δφ적대소래진행첨가제적부산물적표정.수선,채용차방법분석전도액각조분불동농도대Δφ적영향,발현각조분농도재공제범위내변화시,Δφ소우모일정치;연후,통과공기양화、H2O2양화、전해적방법산생부산물,Δφ치유명현적증대;최후,통과불동적처리방식후,Δφ치유명현적강저,대부분적부산물피제거.
In the thesis, we introduce a method which can characterize the by-products of additives in the copper plating process. The specific method is constant current method. With a constant ampere density, we characterize the by-products of additives by calculating the cathode potential change ofΔφ. First of all, using this method analysis of the influence toΔφof different concentration of each components in the plating solution, we find the component concentration change in the range of control,Δφless than a constant value. Then, through the electrolytic, air and H2O2 oxidation methods produce by-products, the value ofΔφsignally increase. Finally, after the different treatment methods, the value ofΔφhas signally reduced, and by-products have almost removed.